Lipseals and contact elements for semiconductor electroplating apparatuses

Patent metadata

Field	Value
Publication number	US-9228270-B2
Application number	US-201213584343-A
Country	US
Kind code	B2
Filing date	Aug 13, 2012
Priority date	Aug 15, 2011
Publication date	Jan 5, 2016
Grant date	Jan 5, 2016

Abstract

Disclosed herein are lipseal assemblies for use in electroplating clamshells which may include an elastomeric lipseal for excluding plating solution from a peripheral region of a semiconductor substrate and one or more electrical contact elements. The contact elements may be structurally integrated with the elastomeric lipseal. The lipseal assemblies may include one or more flexible contact elements at least a portion of which may be conformally positioned on an upper surface of the elastomeric lipseal, and may be configured to flex and form a conformal contact surface that interfaces with the substrate. Some elastomeric lipseals disclosed herein may support, align, and seal a substrate in a clamshell, and may include a flexible elastomeric upper portion located above a flexible elastomeric support edge, the upper portion having a top surface and an inner side surface, the later configured to move inward and align the substrate upon compression of the top surface.

First claim

We claim:

1. A lipseal assembly for use in an electroplating clamshell for engaging and supplying electrical current to a semiconductor substrate during electroplating, the lipseal assembly comprising:
an elastomeric lipseal for engaging the semiconductor substrate during electroplating, wherein upon engagement the elastomeric lipseal substantially excludes plating solution from a peripheral region of the semiconductor substrate; and
one or more flexible contact elements for supplying electrical current to the semiconductor substrate during electroplating, at least a portion of the one or more flexible contact elements positioned on an upper surface of the elastomeric lipseal and configured to flex upon engagement with the semiconductor substrate so as to form a conformal non-planar electrical contact interface with a non-planar surface of the semiconductor substrate.

2. The lipseal assembly of claim 1 , wherein the one or more flexible contact elements are configured so as to form a conformal non-planar electrical contact interface with a bevel edge of a substantially 300 mm diameter semiconductor substrate.

3. The lipseal assembly of claim 1 , wherein the one or more flexible contact elements have a portion which is not configured to contact the substrate when the substrate is engaged by the lipseal assembly, and wherein the non-contacting portion comprises a non-conformable material.

4. The lipseal assembly of claim 1 , wherein the conformal non-planar electrical contact interface formed between the one or more flexible contact elements and the semiconductor substrate is continuous.

5. The lipseal assembly of claim 1 , wherein the conformal non-planar electrical contact interface formed between the one or more flexible contact elements and the semiconductor substrate is non-continuous having gaps.

6. The lipseal assembly of claim 5 , wherein the one or more flexible contact elements comprise multiple wire tips or a wire mesh disposed on the surface of the elastomeric lipseal.

7. The lipseal assembly of claim 1 , wherein the one or more flexible contact elements positioned on the upper surface of the elastomeric lipseal comprise conductive deposits deposited directly on the lipseal using one or more techniques selected from the group consisting of: chemical vapor deposition, physical vapor deposition, and electroplating.

8. The lipseal assembly of claim 1 , wherein the one or more flexible contact elements positioned on the upper surface of the elastomeric lipseal comprise an electrically conductive elastomeric material.

9. The lipseal assembly of claim 1 , wherein the one or more flexible contact elements are configured so as to form a conformal non-planar electrical contact interface with a bevel edge of a substantially 450 mm diameter semiconductor substrate.

10. The lipseal assembly of claim 1 , wherein the one or more flexible contact elements are configured to form a conformal non-planar electrical contact interface with a non-planar surface of the semiconductor substrate by following the shape of said upper surface of the elastomeric lipseal while it is deformed by the pressing of the semiconductor substrate.

Assignees

• Feng Jingbin
• Stowell Marshall
• Wilmot Frederick D
• Novellus Systems Inc

Inventors

• Feng Jingbin
• Stowell Marshall
• Wilmot Frederick D

Classifications

• C25D7/123 Primary

  Semiconductors first coated with a seed layer or a conductive layer · CPC title

• C25D17/004 Primary

  Sealing devices · CPC title

• C25D17/007

  Current directing devices · CPC title

• C25D17/001

  Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells · CPC title

• C25D17/005 Primary

  Contacting devices · CPC title