Detection of plating on wafer holding apparatus

Patent metadata

Field	Value
Publication number	US-9746427-B2
Application number	US-201414178804-A
Country	US
Kind code	B2
Filing date	Feb 12, 2014
Priority date	Feb 15, 2013
Publication date	Aug 29, 2017
Grant date	Aug 29, 2017

Abstract

The embodiments herein relate to methods and apparatus for detecting whether unwanted metallic deposits are present on a bottom of a substrate holder used in an electroplating apparatus. The presence of such unwanted deposits is harmful to electroplating processes because the deposits scavenge current that is intended to cause electroplating on a substrate. When such current scavenging occurs, the electroplating results on the substrates are poor. For instance, features positioned near the edge of a substrate are likely to plate to an insufficient thickness. Further, where such current scavenging is great, the overall thickness of the material plated on the substrate may be too thin. As such, there is a need to detect when such unwanted deposits are present, such that plating under these poor conditions may be avoided. This detection will help preserve costly wafers.

First claim

What is claimed is:

1. A method for detecting the presence or absence of metal deposits on a surface of a non-conductive portion of a substrate holder of an electroplating apparatus, comprising:
rotating a swing arm to position a detection hardware proximate a detection region on the substrate holder,
wherein the substrate holder comprises a bottom and an interior edge; and
operating the detection hardware to detect the presence or absence of metal deposits in the detection region on the substrate holder, wherein the detection region is an annular region on the bottom of the substrate holder that extends at least about 5 mm or more from the interior edge of the substrate holder.

2. The method of claim 1 , wherein the deposits comprise metals having significantly different reduction potentials.

3. The method of claim 1 , wherein operating the detection hardware occurs after a certain number of substrates have been processed using the substrate holder, after a certain amount of charge has passed during deposition on substrates using the substrate holder, or after a certain amount or thickness of metal has been deposited on substrates using the substrate holder.

4. The method of claim 1 , wherein positioning the detection hardware proximate the substrate holder comprises moving the detection hardware from a first position that is not under the substrate holder to a second position that is under the substrate holder, and further comprising moving the detection hardware from the second position after operating the detection hardware to detect the presence or absence of metal deposits.

5. The method of claim 4 , further comprising raising an alarm, taking the electroplating apparatus offline, initiating a cleaning operation, or some combination thereof, in response to the detecting the presence of metal deposits in the detection region.

6. The method of claim 1 , wherein operating the detection hardware comprises shining a source light on the detection region of the substrate holder and measuring a reflected light that reflects off the detection region of the substrate holder.

7. The method of claim 6 , wherein shining a source light on the detection region of the substrate holder comprises shining a light that is complementary in color to a color of the detection region.

8. The method of claim 1 , wherein operating the detection hardware comprises:
flowing an alternating current through a circular primary excitation coil positioned near the detection region to thereby generate a changing magnetic field that interacts with the detection region to produce eddy currents; and
monitoring the phase and/or magnitude of the eddy currents to detect the presence or absence of metal deposits.

9. The method of claim 8 , wherein the monitoring is done with a receiver coil that is distinct from the primary excitation coil.

10. The method of claim 1 , wherein operating the detection hardware comprises:
providing two or more electrical contacts that contact the detection region, wherein there is an electrical connection between the two or more electrical contacts;
flowing current through at least one electrical contact such that when the metal deposit is present in the detection region between the two or more electrical contacts, the metal deposit completes a circuit between the two or more electrical contacts, and when the metal deposit is not present in the detection region between the two or more electrical contacts, there is no complete circuit between the two or more electrical contacts; and
measuring an electrical property to detect the presence or absence of the metal deposit in the detection region.

11. An apparatus for detecting the presence or absence of a metal deposit on a substrate holder of an electroplating apparatus, comprising:
detection hardware positioned on mounting hardware,
wherein the mounting hardware comprises a swing arm that swings into place to bring the detection hardware proximate a detection region on the substrate holder, the substrate holder comprising a bottom and an interior edge, wherein the detection region on the substrate holder is on the bottom of the substrate holder extending about 5 mm or more from the interior edge of the substrate holder, and
wherein the detection hardware is configured to detect the presence or absence of a metal deposit in the detection region of the substrate holder.

12. The apparatus of claim 11 , wherein the mounting hardware is integral with an electroplating apparatus.

13. The apparatus of claim 11 , wherein the apparatus for detecting the presence or absence of a metal deposit can interact with a plurality of substrate holders.

14. The apparatus of claim 11 , wherein the mounting hardware further comprises a cleaning assembly for removing metal deposits from the substrate holder.

15. The apparatus of claim 11 , wherein the detection hardware comprises a light source and a light detector, wherein the light source is configured to shine light on the detection region of the substrate holder, and wherein the light detector is configured to measure light that is reflected off the detection region of the substrate holder.

16. The apparatus of claim 15 , further comprising a filter positioned between the detection region and the light source, or between the detection region and the detector, that filters out wavelengths of light that are normally reflected by the detection region when no metal deposits are present.

17. The apparatus of claim 15 , further comprising one or more optical fibers to carry light between the light source and an optical outlet that shines on the detection region and/or between an optical inlet positioned proximate the detection region and the light detector.

18. The apparatus of claim 17 , wherein the optical outlet that shines on the detection region and the optical inlet positioned proximate the detection region are provided together as an integrated bundle of optical fibers.

19. The apparatus of claim 11 , wherein the detection hardware comprises a circular primary excitation coil through which an alternating current flows to thereby generate a changing magnetic field that interacts with the detection region to produce eddy currents.

20. The apparatus of claim 11 , wherein the detection hardware comprises two or more electrical contacts that contact the detection region, and an electrical connection between the two or more electrical contacts, such that when a metal deposit is present in the detection region between the two or more electrical contacts, an electrical circuit is complete, but when a metal deposit is not present in the detection region between the two or more electrical contacts, the electrical circuit is incomplete.

21. The apparatus of claim 11 , wherein the substrate holder comprises a cup and a lip seal, wherein the bottom and interior edge of the substrate holder are the bottom and interior edge of the cup, wherein the cup comprises a vertical inner surface extending upwards from the interior edge of the cup, and wherein the lip seal is positioned at the top of the vertical inner surface.

Assignees

• Novellus Systems Inc

Inventors

• Mayer Steven T
• Fu Haiying
• Ponnuswamy Thomas Anand
• Buckalew Bryan L

Classifications

• C25D17/001

  Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells · CPC title

• G01N21/9501 Primary

  Semiconductor wafers (manufacturing processes per se of semiconductor devices implementing a measuring step H10P74/20) · CPC title

• C25D17/06

  Suspending or supporting devices for articles to be coated · CPC title

• C25D21/12

  Process control or regulation (controlling or regulating in general G05) · CPC title

• G01N27/9046

  by analysing electrical signals · CPC title