Chip resistor and method for producing chip resistor

Patent metadata

Field	Value
Publication number	US-10410771-B2
Application number	US-201615763574-A
Country	US
Kind code	B2
Filing date	Sep 20, 2016
Priority date	Sep 28, 2015
Publication date	Sep 10, 2019
Grant date	Sep 10, 2019

Abstract

Provided is a chip resistor including: a rectangular parallelepiped insulating substrate 1 which is made of ceramics; a pair of front electrodes 2 which are provided on lengthwise opposite end portions in a front surface of the insulating substrate 1 ; a resistive element 3 which is provided between and connected to the two front electrodes 2 ; an insulating protective layer 4 which covers the whole of the front surface of the insulating substrate 1 including the resistive element 3 and the two front electrodes 2 ; and a pair of cap-shaped end-surface electrodes 5 which are provided on the lengthwise opposite end portions of the insulating substrate 1 to be connected to the front electrodes 2 ; wherein: the protective layer 4 is formed out of a semi-transparent resin material which is similar in color to the insulating substrate 1.

First claim

The invention claimed is:

1. A method for producing a chip resistor, comprising the steps of:
forming a pair of front electrodes on each of chip formation regions in a front surface of a large-sized substrate made of ceramics;
forming resistive elements to be provided between and connected to the pair of front electrodes with each other respectively;
forming a protective layer on the whole of the chip formation regions in the front surface of the large-sized substrate to thereby cover the front electrodes and the resistive elements, the protective layer being made of a semi-transparent resin similar in color to the large-sized substrate;
confirming positions of the front electrodes and the resistive elements through the protective layer to thereby determine dicing positions, and then cutting the large-sized substrate along primary division lines and secondary division lines based on the dicing positions by a dicing blade to thereby form individual chip elements, the primary division lines passing through central portions of the front electrodes and extending in a lengthwise direction, the secondary division lines intersecting the primary division lines perpendicularly; and
applying an electrically conductive paste to areas ranging from cut surfaces of the chip elements along the primary division lines to portions of cut surfaces of the chip elements along the secondary division lines to thereby form end-surface electrodes.

2. The method for producing a chip resistor according to claim 1 , wherein: the large-sized substrate is irradiated with backlight from behind when the positions of the front electrodes and the resistive elements are confirmed through the protective layer.

Assignees

• Koa Corp

Inventors

• Matsumoto Kentaro

Classifications

• H01C1/02

  Housing; Enclosing; Embedding; Filling the housing or enclosure · CPC title

• H01C17/006

  adapted for manufacturing resistor chips · CPC title

• H01C1/012

  the base extending along and imparting rigidity or reinforcement to the resistive element (H01C1/016 takes precedence; the resistive element being formed in two or more coils or loops as a spiral, helical or toroidal winding H01C3/18, H01C3/20; the resistive element being formed as one or more layers or coatings on a base H01C7/00) · CPC title

• H01C1/148

  the terminals embracing or surrounding the resistive element (H01C1/142 takes precedence) · CPC title

• H01C1/034 Primary

  the housing or enclosure being formed as coating or mould without outer sheath (H01C1/032 takes precedence) · CPC title