Housing; Enclosing; Embedding; Filling the housing or enclosure

Housing; Enclosing; Embedding; Filling the housing or enclosure · Cooperative Patent Classification (CPC)

Electric circuits, power, telecommunications, and semiconductors.

Related technology areas

Mapped technology topics for this CPC code.

CPC classification statistics
MetricValue
CPC codeH01C1/02
Official titleHousing; Enclosing; Embedding; Filling the housing or enclosure
Display labelHousing; Enclosing; Embedding; Filling the housing or enclosure
Total patents174

Filing trend

Year-over-year patent counts classified under this CPC code.

Filing activity over the last five years is stable.

Patents filed per year
YearPatents
20153
201611
201711
201816
201919
202028
202120
202213
202316
20249
202523
20265

Representative patents

Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.

Frequently asked questions

Answers are generated from the same data shown on this page.

What is CPC H01C1/02?
CPC H01C1/02 is the Cooperative Patent Classification code for “Housing; Enclosing; Embedding; Filling the housing or enclosure.”
How many patents are filed under CPC H01C1/02 (Housing; Enclosing; Embedding; Filling the housing or enclosure)?
Our database includes 174 publications tagged with this CPC code.
Is patent activity under CPC H01C1/02 growing?
Publication counts under this code: 9 in 2024 vs 23 in 2025 (latest complete years).