Permanent secondary erosion containment for electrostatic chuck bonds

Patent metadata

Field	Value
Publication number	US-10340171-B2
Application number	US-201615157959-A
Country	US
Kind code	B2
Filing date	May 18, 2016
Priority date	May 18, 2016
Publication date	Jul 2, 2019
Grant date	Jul 2, 2019

Abstract

A substrate support in a substrate processing system includes a baseplate, a ceramic layer, and a bond layer. The ceramic layer is arranged on the baseplate to support a substrate. The bond layer is arranged between the ceramic layer and the baseplate. A seal is arranged between the ceramic layer and the baseplate around an outer perimeter of the bond layer. The seal includes an inner layer formed adjacent to the bond layer and an outer layer formed adjacent to the inner layer such that the inner layer is between the outer layer and the bond layer. The inner layer comprises a first material and the outer layer comprises a second material.

First claim

What is claimed is:

1. A substrate support in a substrate processing chamber, the substrate support comprising:
a baseplate,
a ceramic layer arranged on the baseplate, the ceramic layer arranged to support a substrate;
a bond layer arranged between the ceramic layer and the baseplate; and
a seal arranged between the ceramic layer and the baseplate around an outer perimeter of the bond layer, wherein the seal includes
an inner layer formed adjacent to the bond layer, wherein the inner layer comprises a first material, and wherein the first material includes at least one of silicone and an epoxy, and
an outer layer formed adjacent to the inner layer such that the inner layer is between the outer layer and the bond layer, wherein the outer layer comprises a second material,
wherein the inner layer extends from an upper surface of the baseplate to a lower surface of the ceramic layer to seal the bond layer from the substrate processing chamber,
an outer surface of the inner layer is concave and the outer layer includes an O-ring, and
the outer layer does not contact the bond layer.

2. The substrate support of claim 1 , wherein the outer layer includes a core comprising a third material different from the second material.

3. The substrate support of claim 2 , wherein the third material is a perfluoroelastomer polymer.

4. The substrate support of claim 2 , wherein the third material has a higher elasticity than the second material.

5. The substrate support of claim 1 , wherein the second material has a higher resistance to plasma than the first material.

6. The substrate support of claim 1 , wherein the inner layer is directly adjacent to and abuts the bond layer and the outer layer is spaced apart from the inner layer.

7. A method, comprising:
arranging a ceramic layer on baseplate of a substrate support in a substrate processing chamber, the ceramic layer arranged to support a substrate;
arranging a bond layer between the ceramic layer and the baseplate; and
arranging a seal between the ceramic layer and the baseplate around an outer perimeter of the bond layer, wherein the seal includes
an inner layer formed adjacent to the bond layer, wherein the inner layer comprises a first material, and wherein the first material includes at least one of silicone and an epoxy, and
an outer layer formed adjacent to the inner layer such that the inner layer is between the outer layer and the bond layer, wherein the outer layer comprises a second material,
wherein the inner layer extends from an upper surface of the baseplate to a lower surface of the ceramic layer to seal the bond layer from the substrate processing chamber,
an outer surface of the inner layer is concave and the outer layer includes an O-ring, and
the outer layer does not contact the bond layer.

8. The method of claim 7 , wherein the outer layer includes a core comprising a third material different from the second material.

9. The method of claim 8 , wherein the third material is a perfluoroelastomer polymer.

10. The method of claim 8 , wherein the third material has a higher elasticity than the second material.

11. The method of claim 7 , wherein the second material has a higher resistance to plasma than the first material.

Assignees

• Lam Res Corp

Inventors

• Pape Eric A

Classifications

• H10P72/7624

  characterised by the mechanical construction of the susceptor, stage or support · CPC title

• H10P72/7616

  characterised by a coating, a hardness or a material · CPC title

• H10P72/7611

  characterised by edge profile or support profile · CPC title

• H10P72/72

  using electrostatic chucks · CPC title

• H10P72/722 Primary

  Details of electrostatic chucks · CPC title