Metal recycling method and metal recycling equipment thereof

Patent metadata

Field	Value
Publication number	US-10319618-B2
Application number	US-201615276141-A
Country	US
Kind code	B2
Filing date	Sep 26, 2016
Priority date	Sep 25, 2015
Publication date	Jun 11, 2019
Grant date	Jun 11, 2019

Abstract

A metal recycling method comprises attaching a tape to a metal layer of a semiconductor structure; and separating a part of the metal layer from the semiconductor structure and transferring the part of the metal layer to the tape by a pressure difference.

First claim

What is claimed is:

1. A metal recycling method, which comprises:
attaching a tape to a metal layer of a semiconductor structure, and wherein the metal layer comprises gold, silver, platinum, aluminum or copper; and
providing a first pressure difference to separate a part of the metal layer from the semiconductor structure and transfer the part of the metal layer to the tape.

2. The metal recycling method of claim 1 , wherein the first pressure difference is 1.5 atm to 3.5 atm.

3. The metal recycling method of claim 1 , further comprising providing a second pressure difference to attach the tape to the metal layer of a semiconductor structure.

4. The metal recycling method of claim 1 , wherein the semiconductor structure comprises a semiconductor stack, an electrode formed on the semiconductor stack, a sacrificial layer formed on the semiconductor stack and not deposited on the electrode, and the metal layer formed on the electrode and the sacrificial layer.

5. The metal recycling method of claim 4 , wherein the part of the metal layer deposited on the sacrificial layer is transferred to the tape.

6. The metal recycling method of claim 5 , wherein another part of the metal layer on the electrode remains on the semiconductor structure after the part of the metal layer is transferred to the tape.

7. The metal recycling method of claim 1 , further comprising providing a metal recycling equipment comprising the tape and a metal removing apparatus wherein the tape is located, and wherein the metal removing apparatus comprises an upper hollow cavity and a lower hollow cavity on the opposite sides of the tape.

8. The metal recycling method of claim 7 , wherein the first pressure difference is achieved by inflating the lower hollow cavity.

9. The metal recycling method of claim 8 , wherein a first pressure in the lower hollow cavity is inflated to 40˜60 PSI when separating the part of the metal layer from the semiconductor structure.

10. The metal recycling method of claim 3 , further comprising providing a metal recycling equipment comprising the tape and a metal removing apparatus wherein the tape is located, and wherein the metal removing apparatus comprises an upper hollow cavity and a lower hollow cavity on the opposite sides of the tape.

11. The metal recycling method of claim 10 , wherein the second pressure difference is achieved by inflating the upper hollow cavity.

12. The metal recycling method of claim 11 , wherein a second pressure in the upper hollow cavity is inflated to 40˜60 PSI when attaching the tape to the metal layer.

13. The metal recycling method of claim 10 , wherein the second pressure difference is achieved by exhausting the lower hollow cavity.

14. The metal recycling method of claim 7 , wherein the metal recycling equipment further comprises a deformable chamber which is able to change its size in the upper hollow cavity, and the tape is attached to the metal layer through pressing the tape toward the metal layer by the deformable chamber.

15. The metal recycling method of claim 14 , wherein the metal recycling equipment further comprises a rotating member to drive the deformable chamber to rotate.

16. The metal recycling method of claim 14 , wherein a path of the deformable chamber is a planetary moving path or a spiral moving path when the tape is pressed by the deformable chamber.

17. The metal recycling method of claim 7 , wherein the metal recycling equipment further comprises a carrier and a lifting shaft in the metal recycling equipment, and the lifting shaft connects to the carrier to control the lift and the fall of the carrier.

18. The metal recycling method of claim 7 , wherein the metal recycling equipment further comprises a pressure controlling tube connecting to the upper hollow cavity or a lower hollow cavity.

19. The metal recycling method of claim 7 , wherein the metal recycling equipment further comprises a metal recycling tank.

Assignees

• Epistar Corp

Inventors

• Tseng Chun-Lung
• Lin Hung-Yao
• Wang Hsin-Yi
• HU Chin-Kang
• Chuang Sheng-Hsiung

Classifications

• H10P72/0428

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• H10P72/0442 Primary

  Apparatus for placing on an insulating substrate, e.g. tape · CPC title

• B32B2311/12

  Copper · CPC title

• B32B2311/00

  Metals, their alloys or their compounds · CPC title

• B32B37/025

  Transfer laminating · CPC title