A process for electrochemical deposition of copper with different current densities
US-2024183052-A1 · Jun 6, 2024 · US
US2020308705A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2020308705-A1 |
| Application number | US-202016828413-A |
| Country | US |
| Kind code | A1 |
| Filing date | Mar 24, 2020 |
| Priority date | Mar 26, 2019 |
| Publication date | Oct 1, 2020 |
| Grant date | — |
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A metal-plated carbon material includes: a carbon material; and a metal layer covering a surface of the carbon material, in which, in the metal layer, crystal grains forming the metal layer have an average crystal grain size of 110 nm or less. A method of manufacturing a metal-plated carbon material, includes: a metal complex fixation step of immersing a carbon material in a supercritical fluid or subcritical fluid containing an organometallic complex of a first metal; and a first energization deposition step of energizing the metal-complex-fixed carbon material in an electroless plating solution containing a second metal.
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What is claimed is: 1 . A metal-plated carbon material comprising: a carbon material; and a metal layer covering a surface of the carbon material, wherein in the metal layer, crystal grains forming the metal layer have an average crystal grain size of 110 nm or less. 2 . The metal-plated carbon material according to claim 1 , wherein the metal layer is made from one or more metals selected from the group consisting of palladium, copper, nickel, cobalt, gold, silver, and platinum. 3 . A method of manufacturing a metal-plated carbon material, comprising: a metal complex fixation step of immersing a carbon material in a supercritical fluid or subcritical fluid containing an organometallic complex of a first metal to form a metal-complex-fixed carbon material in which the organometallic complex is fixed to a surface of the carbon material; and a first energization deposition step of energizing the metal-complex-fixed carbon material in an electroless plating solution containing a second metal to decompose the organometallic complex of the first metal and deposit the second metal on the surface of the carbon material. 4 . A method of manufacturing a metal-plated carbon material, comprising: a metal complex fixation step of immersing a carbon material in a supercritical fluid or subcritical fluid containing an organometallic complex of a first metal to form a metal-complex-fixed carbon material in which the organometallic complex is fixed to a surface of the carbon material; and a second energization deposition step of energizing the metal-complex-fixed carbon material in a conductive aqueous solution having conductivity of 100 μS/cm or more to decompose the organometallic complex of the first metal and deposit the first metal on the surface of the carbon material. 5 . The method according to claim 3 , wherein the first metal is made from one or more metals selected from the group consisting of palladium, copper, nickel, cobalt, gold, silver, and platinum. 6 . The method according to claim 3 , wherein the second metal is made from one or more metals selected from the group consisting of palladium, copper, nickel, cobalt, gold, silver, and platinum. 7 . The method according to claim 3 , wherein current density of energization in the first energization deposition step or the second energization deposition step is 0.01 A/cm 2 or less.
Gold · CPC title
comprising metal as the main or only constituent of a layer, {which is} next to another layer of {the same or of} a {different material (next to a bituminous or tarry layer B32B11/08; next to a water-setting substance layer B32B13/06; next to a glass layer B32B17/061; next to a cellulosic plastic layer B32B23/042)} · CPC title
Platinum · CPC title
Group VIII or IB metal-base component · CPC title
Electric field · CPC title
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