Plating method, bubble ejection member, plating apparatus, and device

Patent metadata

Field	Value
Publication number	US-2020240031-A1
Application number	US-201816757109-A
Country	US
Kind code	A1
Filing date	Oct 17, 2018
Priority date	Oct 19, 2017
Publication date	Jul 30, 2020
Grant date	—

Abstract

A method that can plate a predetermined position on various plating targets without implementing a pretreatment thereon is provided. A plating method is performed on a plating target using a plating solution, and the plating method includes at least a bubble ejection step of ejecting a bubble generated by a bubble ejection member to a plating solution. The bubble ejection member includes an electrode formed of a conductive material and an insulating material covering at least a part of the electrode, at least a part of the insulating material forms a bubble ejection port, and an air gap surrounded by the insulating material is formed between at least a part of the electrode and the bubble ejection port.

First claim

1 . A plating method performed on a plating target using a plating solution, the plating method comprising at least:
a bubble ejection step of ejecting a bubble generated by a bubble ejection member to a plating solution, wherein the bubble ejection member includes an electrode formed of a conductive material, and an insulating material covering at least a part of the electrode, and wherein at least a part of the insulating material forms a bubble ejection port, and an air gap surrounded by the insulating material is formed between at least a part of the electrode and the bubble ejection port.

2 . The plating method according to claim 1 ,
wherein the plating solution contains metal ions, and wherein the metal ions in the plating solution are converted into a metal by ejecting a bubble generated by the bubble ejection member to the plating solution in the bubble ejection step.

3 . The plating method according to claim 1 , wherein the plating solution contains metal nanoparticles.

4 . The plating method according to claim 1 , wherein the bubble ejection step forms a recess in the plating target by the ejected bubble, and a metal is formed inside the recess.

5 . The plating method according to claim 1 , wherein the bubble ejection step forms a metal on the plating target continuously by ejecting bubbles while changing a relative position of the bubble ejection port and the plating target.

6 . The plating method according to claim 1 , wherein the bubble ejection member includes a flow path to supply the plating solution to at least a part of the electrode,
wherein the flow path is formed inside the electrode, and/or formed by a combination of the electrode and the insulating material.

7 . The plating method according to claim 1 , wherein at least a part of the electrode has an acute shape.

8 . The plating method according to claim 1 , wherein the plating target is of a type selected from a metal, a resin, an animal, or a plant.

9 . A bubble ejection member comprising:
an electrode formed of a conductive material; and an insulating material covering at least a part of the electrode, wherein at least a part of the insulating material forms a bubble ejection port, and an air gap surrounded by the insulating material is formed between at least a part of the electrode and the bubble ejection port, wherein the bubble ejection member includes a flow path to supply a liquid to at least a part of the electrode, wherein the flow path is formed inside the electrode, and/or formed by a combination of the electrode and the insulating material.

10 . The bubble ejection member according to claim 9 , wherein at least a part of the electrode has an acute shape.

11 . A plating apparatus comprising:
the bubble ejection member according to claim 9 ; and an electrical output mechanism that causes a bubble to be ejected from the bubble ejection member.

12 . A device comprising at least a substrate, a recess formed in the substrate, and a metal layer formed inside the recess,
wherein the recess is formed from a substrate surface toward a substrate internal portion, wherein when the recess is viewed in a cross section in a direction substantially perpendicular to the substrate surface, and distances in the recess are compared by a distance parallel to the substrate surface, the substrate internal portion of the recess has a shape having a portion longer than a length of an opening of the recess in the substrate.

13 . The device according to claim 12 , wherein recesses are continuously formed, and a metal is continuously arranged inside the continuously formed recesses.

14 . The plating method according to claim 2 , wherein the plating solution contains metal nanoparticles.

15 . The plating method according to claim 2 , wherein the bubble ejection step forms a recess in the plating target by the ejected bubble, and a metal is formed inside the recess.

16 . The plating method according to claim 2 , wherein the bubble ejection step forms a metal on the plating target continuously by ejecting bubbles while changing a relative position of the bubble ejection port and the plating target.

17 . The plating method according to claim 2 , wherein the bubble ejection member includes a flow path to supply the plating solution to at least a part of the electrode,
wherein the flow path is formed inside the electrode, and/or formed by a combination of the electrode and the insulating material.

18 . The plating method according to claim 2 , wherein at least a part of the electrode has an acute shape.

19 . The plating method according to claim 2 , wherein the plating target is of a type selected from a metal, a resin, an animal, or a plant.

20 . A plating apparatus comprising:
the bubble ejection member according to claim 10 ; and an electrical output mechanism that causes a bubble to be ejected from the bubble ejection member.

Assignees

• Univ Kyushu Nat Univ Corp

Inventors

• Yamanishi Yoko
• Fukuyama Yudai
• Ichikawa Keita

Classifications

• C25D7/00

  Electroplating characterised by the article coated · CPC title

• C23C18/1671

  Electric field · CPC title

• B05B17/0607

  generated by electrical means, e.g. piezoelectric transducers · CPC title

• C25D7/12

  Semiconductors · CPC title

• C25D5/56

  of plastics · CPC title