Plating method, bubble ejection member, plating apparatus, and device

Patent metadata

Field	Value
Publication number	US-11242610-B2
Application number	US-201816757109-A
Country	US
Kind code	B2
Filing date	Oct 17, 2018
Priority date	Oct 19, 2017
Publication date	Feb 8, 2022
Grant date	Feb 8, 2022

Abstract

A method that can plate a predetermined position on various plating targets without implementing a pretreatment thereon is provided. A plating method is performed on a plating target using a plating solution, and the plating method includes at least a bubble ejection step of ejecting a bubble generated by a bubble ejection member to a plating solution. The bubble ejection member includes an electrode formed of a conductive material and an insulating material covering at least a part of the electrode, at least a part of the insulating material forms a bubble ejection port, and an air gap surrounded by the insulating material is formed between at least a part of the electrode and the bubble ejection port.

First claim

The invention claimed is:

1. A plating method performed on a plating target using a plating solution and a bubble ejection member,
wherein the bubble ejection member includes:
an electrode formed of a conductive material; and
an insulating member covering at least a part of the electrode, and

at least a part of the insulating member forms a bubble ejection port, and an air gap surrounded by the insulating member is formed between at least a part of the electrode and the bubble ejection port,
the plating method comprising at least:
supplying the plating solution to a target portion of the plating target to be plated;
ejecting a bubble generated by the bubble ejection member from the bubble ejection port to the plating solution on the plating target; and
performing plating the target portion of the plating target,

wherein the ejecting the bubble comprises applying a voltage between the electrode and a counter electrode, and
the counter electrode is a member different from the plating target and placed at a location other than the air gap of the bubble ejection member.

2. The plating method according to claim 1 ,
wherein the plating solution contains metal ions, and
wherein the metal ions in the plating solution are converted into a metal by ejecting the bubble generated by the bubble ejection member to the plating solution.

3. The plating method according to claim 1 , wherein the plating solution contains metal nanoparticles.

4. The plating method according to claim 1 , wherein in the ejecting the bubble, a recess is formed in the plating target by the ejected bubble, and a metal is formed inside the recess.

5. The plating method according to claim 1 , wherein in the ejecting the bubble, a metal is formed on the plating target continuously by ejecting bubbles while changing a relative position of the bubble ejection port and the plating target.

6. The plating method according to claim 1 , wherein the bubble ejection member includes a flow path to supply the plating solution to at least a part of the electrode,
wherein the flow path is
formed inside the electrode, and/or
formed by a combination of the electrode and the insulating member.

7. The plating method according to claim 1 , wherein at least a part of the electrode has an acute shape.

8. The plating method according to claim 1 , wherein the plating target is of a type selected from a metal, a resin, an animal, or a plant.

9. The plating method according to claim 2 , wherein the plating solution contains metal nanoparticles.

10. The plating method according to claim 2 , wherein in the ejecting the bubble, a recess is formed in the plating target by the ejected bubble, and a metal is formed inside the recess.

11. The plating method according to claim 2 , wherein in the ejecting the bubble, a metal is formed on the plating target continuously by ejecting bubbles while changing a relative position of the bubble ejection port and the plating target.

12. The plating method according to claim 2 , wherein the bubble ejection member includes a flow path to supply the plating solution to at least a part of the electrode,
wherein the flow path is
formed inside the electrode, and/or
formed by a combination of the electrode and the insulating member.

13. The plating method according to claim 2 , wherein at least a part of the electrode has an acute shape.

14. The plating method according to claim 2 , wherein the plating target is of a type selected from a metal, a resin, an animal, or a plant.

15. The plating method according to claim 1 , wherein the counter electrode is placed in contact with the plating solution.

16. The plating method according to claim 15 , wherein the counter electrode is placed in contact with the plating target.

Assignees

• Univ Kyushu Nat Univ Corp

Inventors

• Yamanishi Yoko
• Fukuyama Yudai
• Ichikawa Keita

Classifications

• C25D7/00

  Electroplating characterised by the article coated · CPC title

• C25D5/026

  using locally applied jets of electrolyte · CPC title

• C25D5/56

  of plastics · CPC title

• C25D3/38

  of copper · CPC title

• C25D7/12

  Semiconductors · CPC title