Metal mask substrate, metal mask substrate control method, metal mask, and metal mask production method

Patent metadata

Field	Value
Publication number	US-10273569-B2
Application number	US-201715786463-A
Country	US
Kind code	B2
Filing date	Oct 17, 2017
Priority date	Jul 17, 2015
Publication date	Apr 30, 2019
Grant date	Apr 30, 2019

Abstract

A metal mask substrate includes a metal surface to which a resist is to be disposed. A specular reflectance of incident light to the surface is 45.2% or more.

First claim

The invention claimed is:

1. A metal mask substrate comprising a metal surface to which a resist is to be disposed, wherein a specular reflectance of incident light to the surface is 45.2% or more,
the metal mask substrate has a width direction orthogonal to a rolling direction of the metal mask substrate,
a specular reflectance in a first plane orthogonal to the surface and orthogonal to the rolling direction is a first reflectance,
a specular reflectance in a second plane orthogonal to the surface and orthogonal to the width direction is a second reflectance,
the second reflectance is larger than the first reflectance, and
the first reflectance is 45.2% or more.

2. The metal mask substrate according to claim 1 , wherein the surface includes a portion in which a difference obtained by subtracting the first reflectance from the second reflectance is 10.2% or more.

3. The metal mask substrate according to claim 1 , wherein the surface has a three-dimensional surface roughness Sa of 0.11 μm or less and a three-dimensional surface roughness Sz of 3.17 μm or less.

4. The metal mask substrate according to claim 1 , wherein
the surface is a first surface,
the resist is a first resist,
the metal mask substrate further comprising a metal second surface to which a resist is to be disposed, the second surface being a surface opposite to the first surface, and
a specular reflectance of incident light to the second surface is 45.2% or more.

5. The metal mask substrate according to claim 1 , wherein the surface is made of invar.

6. The metal mask substrate according to claim 1 , wherein the resist is a dry film resist, and
the dry film resist is adhered to the surface.

Assignees

• Toppan Printing Co Ltd

Inventors

• Tamura Sumika
• Mikami Naoko
• Fujito Daisei
• Nishitsuji Kiyoaki
• Nishi Takehiro

Classifications

• C23C14/225

  Oblique incidence of vaporised material on substrate · CPC title

• C23F1/44

  Compositions for etching metallic material from a metallic material substrate of different composition · CPC title

• C23C14/028

  Physical treatment to alter the texture of the substrate surface, e.g. grinding, polishing · CPC title

• C23C14/042 Primary

  using masks · CPC title

• G03F7/0002

  Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping · CPC title