Method of producing stresses in a semiconductor wafer
US-10825732-B2 · Nov 3, 2020 · US
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Lichtensteiger Lukas patents
Lichtensteiger Lukas is listed as an inventor on 11 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lichtensteiger Lukas |
| Total patents | 11 |
| First publication | Mar 3, 2016 |
| Latest publication | Nov 3, 2020 |
Notable patents
Publications ranked by popularity score, then publication date.
Method of Producing Stresses in a Semiconductor Wafer
US-2020144121-A1 · May 7, 2020 · US
Method and device for the production of wafers with a pre-defined break initiation point
US-10580699-B1 · Mar 3, 2020 · US
Method and device for the production of wafers with a pre-defined break initiation point
US-10304738-B2 · May 28, 2019 · US
Method and device for the production of wafers with a pre-defined break initiation point
US-10269643-B2 · Apr 23, 2019 · US
Method and device for the production of wafers with a pre-defined break initiation point
US-2019019729-A1 · Jan 17, 2019 · US
Method of producing large-scale layers of solid material
US-10029277-B2 · Jul 24, 2018 · US
Method for the production of a wafer with a carrier unit
US-9754810-B2 · Sep 5, 2017 · US
Method of producing large-scale layers of solid material
US-2017029974-A1 · Feb 2, 2017 · US
Method For The Production Of A Wafer With A Carrier Unit
US-2016086839-A1 · Mar 24, 2016 · US
Recent patents
Latest publications not already listed above.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Siltectra Gmbh | 11 |
| Siltectra | 1 |
| Siltectra Gmbh | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P90/00 | 11 |
| H10P52/00 | 11 |
| H10P90/1904 | 11 |
| H10P72/74 | 9 |
| H01L21/6835 | 9 |