Ionic polyamide and polyamide-imide materials and methods of use
US-2018230272-A1 · Aug 16, 2018 · US
Nitrogen containing polymers as levelers
US10196751B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10196751-B2 |
| Application number | US-201315021075-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 6, 2013 |
| Priority date | Nov 6, 2013 |
| Publication date | Feb 5, 2019 |
| Grant date | Feb 5, 2019 |
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Abstract
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Polymers of reaction products of polyamines and nitrogen containing cyclic compounds are included in metal electroplating compositions to provide level metal deposits on substrates.
First claim
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What is claimed is: 1. A copper electroplating composition comprises: one or more sources of copper ions, an acid electrolyte, wherein the acid electrolyte comprises one or more acids and, optionally, one or more sources of halide ions, and one or more polymers, wherein the one or more polymers have the following structures: wherein R is chosen from a covalent bond, linear or branched (C 1 -C 12 )alkyl, —NH—, —R 2 NH— or —R 2 NHR 3 —, R 2 is chosen from linear or branched (C 1 -C 12 )alkyl, R 12 , R 13 and R 14 are independently chosen from hydrogen, linear or branched (C 1 -C 12 )alkyl, substituted or unsubstituted aryl, hydroxylalkyl, hydroxyl, thio, thioalkyl, —NH 2 , primary amine or secondary amine, u is carbon or nitrogen, p is an integer from 1-10 and g is an integer of 2 or greater, and X − is a halide. 2. The copper electroplating composition of claim 1 , wherein the one or more polymers are included in the composition in amounts from 0.01 ppm to 5,000 ppm. 3. The copper electroplating composition of claim 1 , further comprising one or more accelerators and suppressors.
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Classifications
by direct electroplating · CPC title
of copper · CPC title
Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors · CPC title
containing more than 50% by weight of copper · CPC title
Electroplating, e.g. finish plating · CPC title
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- What does patent US10196751B2 cover?
- Polymers of reaction products of polyamines and nitrogen containing cyclic compounds are included in metal electroplating compositions to provide level metal deposits on substrates.
- Who is the assignee on this patent?
- Rohm & Haas Elect Mat, Dow Global Technologies Llc
- What technology area does this patent fall under?
- Primary CPC classification C08G73/0616. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Feb 05 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).