Low power cooling and flow inducement
US-2016356556-A1 · Dec 8, 2016 · US
High-conductivity bonding of metal nanowire arrays
US10180288B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10180288-B2 |
| Application number | US-201715422602-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 2, 2017 |
| Priority date | Feb 26, 2015 |
| Publication date | Jan 15, 2019 |
| Grant date | Jan 15, 2019 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: removing a template membrane from the MNW; infiltrating the MNW with a bonding material; placing the bonding material on the adjacent surface; bringing an adjacent surface into contact with a top surface of the MNW while the bonding material is bondable; and allowing the bonding material to cool and form a solid bond between the MNW and the adjacent surface. A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: choosing a bonding material based on a desired bonding process; and without removing the MNW from a template membrane that fills an interstitial volume of the MNW, depositing the bonding material onto a tip of the MNW.
First claim
Opening claim text (preview).
What is claimed is: 1. A metal nanowire (MNW) array attached at MNW tips to a surface adjacent to the MNW array by thermally-conductive phase change bonding material filling a template membrane on top of the MNW array, wherein the MNW array is partially subfilled within the template membrane, the bonding material consisting of tin, the MNW array consisting of one or more of copper and silver.
Assignees
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Classifications
Compression bonding, e.g. thermocompression bonding · CPC title
Connecting techniques · CPC title
by plating, e.g. electroless plating or electroplating · CPC title
using blanket deposition · CPC title
comprising metals or metalloids, e.g. solders · CPC title
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- What does patent US10180288B2 cover?
- A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: removing a template membrane from the MNW; infiltrating the MNW with a bonding material; placing the bonding material on the adjacent surface; bringing an adjacent surface into contact with a top surface of the MNW while the bonding material is b…
- Who is the assignee on this patent?
- Northrop Grumman Systems Corp, Univ Leland Stanford Junior
- What technology area does this patent fall under?
- Primary CPC classification F28F3/022. Mapped technology areas include Mechanical Engineering.
- When was this patent published?
- Publication date Tue Jan 15 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).