Hybrid capillary-driven phase-change micro-cooler having passive coolant recirculation
US-2025254828-A1 · Aug 7, 2025 · US
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Goodson Kenneth E patents
Goodson Kenneth E is listed as an inventor on 26 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Goodson Kenneth E |
| Total patents | 26 |
| First publication | Sep 1, 2016 |
| Latest publication | Aug 7, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Micro-cooler assemblies
US-2025189240-A1 · Jun 12, 2025 · US
Continuously-cycled water harvesting for dry cooling tower operated power plants
US-12274974-B2 · Apr 15, 2025 · US
Systems for cooler devices and cooling manifolds
US-12274026-B2 · Apr 8, 2025 · US
Systems for cooler devices and cooling manifolds
US-2023380106-A1 · Nov 23, 2023 · US
Multi-level hierarchical hybrid structures to replace single-level wicks in next generation vapor chambers
US-2023314090-A1 · Oct 5, 2023 · US
Heat flux micro coolers having multi-stepped features and fluid wicking
US-11729951-B2 · Aug 15, 2023 · US
Heat flux micro coolers having multi-stepped features and fluid wicking
US-2023225082-A1 · Jul 13, 2023 · US
Hardmask to substrate pattern transfer method for Microfabrication of micro to mesoscale, high aspect ratio, multi-level, 3D Structures
US-2023197448-A1 · Jun 22, 2023 · US
Continuously-Cycled Water Harvesting for Dry Cooling Tower Operated Power Plants
US-2022370951-A1 · Nov 24, 2022 · US
Recent patents
Latest publications not already listed above.
Low-power phase-change memory technology with interfacial thermoelectric heating enhancement
US-2022115590-A1 · Apr 14, 2022 · US
Method of etching microelectronic mechanical system features in a silicon wafer
US-10784115-B2 · Sep 22, 2020 · US
Method of etching microelectronic mechanical system features in a silicon wafer
US-2019333773-A1 · Oct 31, 2019 · US
Method of etching microelectronic mechanical system features in a silicon wafer
US-2019287810-A1 · Sep 19, 2019 · US
Method of etching microelectronic mechanical system features in a silicon wafer
US-10395940-B1 · Aug 27, 2019 · US
High-conductivity bonding of metal nanowire arrays
US-10180288-B2 · Jan 15, 2019 · US
Vapor chamber heat flux rectifier and thermal switch
US-10066876-B2 · Sep 4, 2018 · US
Vapor chamber heat flux rectifier and thermal switch
US-2018073814-A1 · Mar 15, 2018 · US
High-conductivity bonding of metal nanowire arrays
US-2017146302-A1 · May 25, 2017 · US
High-conductivity bonding of metal nanowire arrays
US-9601452-B2 · Mar 21, 2017 · US
Graphene-inserted phase change memory device and method of fabricating the same
US-9583702-B2 · Feb 28, 2017 · US
High-conductivity bonding of metal nanowire arrays
US-2016372438-A1 · Dec 22, 2016 · US
High-conductivity bonding of metal nanowire arrays
US-9468989-B2 · Oct 18, 2016 · US
Graphene-inserted phase change memory device and method of fabricating the same
US-2016276585-A1 · Sep 22, 2016 · US
Thermal interface materials using metal nanowire arrays and sacrificial templates
US-2016251769-A1 · Sep 1, 2016 · US
High-conductivity bonding of metal nanowire arrays
US-2016250710-A1 · Sep 1, 2016 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Univ Leland Stanford Junior | 26 |
| Toyota Eng & Mfg North America | 11 |
| Northrop Grumman Systems Corp | 7 |
| The Regents Of The Univ Of California Merced | 4 |
| Alliance Sustainable Energy | 4 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| F28F3/022 | 8 |
| H10W40/73 | 7 |
| H10W40/258 | 7 |
| H10W40/251 | 7 |
| H10W40/25 | 7 |