Fully 3D Printed mm-Wave Board Embedded Designs with High Integration Levels
US-2026082489-A1 · Mar 19, 2026 · US
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Tice Jesse B patents
Tice Jesse B is listed as an inventor on 31 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Tice Jesse B |
| Total patents | 31 |
| First publication | Jan 28, 2016 |
| Latest publication | Mar 19, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
On-demand multi-layer insulation, radiator panels including same, and space vehicles including such radiator panels
US-12384564-B2 · Aug 12, 2025 · US
On-demand multi-layer insulation, radiator panels including same, and space vehicles including such radiator panels
US-2025128833-A1 · Apr 24, 2025 · US
Multilayered metal nanowire array
US-11800602-B1 · Oct 24, 2023 · US
Semiconductor device passive thermal management
US-11784107-B1 · Oct 10, 2023 · US
Semiconductor device passive thermal management
US-11488889-B1 · Nov 1, 2022 · US
Multilayered nanowire arrays with lateral interposers
US-11229090-B2 · Jan 18, 2022 · US
Mechanism for variable thermal conductance
US-2021293495-A1 · Sep 23, 2021 · US
Multilayered nanowire arrays with lateral interposers
US-2020359465-A1 · Nov 12, 2020 · US
Wafer-scale catalytic deposition of black phosphorus
US-10727050-B1 · Jul 28, 2020 · US
Recent patents
Latest publications not already listed above.
3D RF-substrate patterning
US-10211497-B1 · Feb 19, 2019 · US
Alloy bonded graphene sheets for enhanced thermal spreaders
US-10182493-B2 · Jan 15, 2019 · US
High-conductivity bonding of metal nanowire arrays
US-10180288-B2 · Jan 15, 2019 · US
Large-scale reconfigurable electronics using low cost nanoparticle ink printing method
US-10091888-B2 · Oct 2, 2018 · US
Alloy bonded graphene sheets for enhanced thermal spreaders
US-2018206328-A1 · Jul 19, 2018 · US
Compressible, thermally-conductive, removable nanocomposite gasket
US-9920178-B2 · Mar 20, 2018 · US
Nano-thermal agents for enhanced interfacial thermal conductance
US-9741636-B1 · Aug 22, 2017 · US
Alloy bonded graphene sheets for enhanced thermal spreaders
US-9736923-B1 · Aug 15, 2017 · US
Large-scale reconfigurable electronics using low-cost nanoparticle ink printing method
US-2017223838-A1 · Aug 3, 2017 · US
Compressible, thermally-conductive, removable nanocomposite gasket
US-2017166721-A1 · Jun 15, 2017 · US
High-conductivity bonding of metal nanowire arrays
US-2017146302-A1 · May 25, 2017 · US
Nanoparticle thermal interface agents for reducing thermal conductance resistance
US-9613882-B2 · Apr 4, 2017 · US
High-conductivity bonding of metal nanowire arrays
US-9601452-B2 · Mar 21, 2017 · US
Visible/infrared absorber vertically aligned carbon nanotube nanocomposite applique
US-2017029275-A1 · Feb 2, 2017 · US
Nanoparticle thermal interface agents for reducing thermal conductance resistance
US-2017005026-A1 · Jan 5, 2017 · US
High-conductivity bonding of metal nanowire arrays
US-2016372438-A1 · Dec 22, 2016 · US
Nano-thermal agents for enhanced interfacial thermal conductance
US-9482477-B2 · Nov 1, 2016 · US
High-conductivity bonding of metal nanowire arrays
US-9468989-B2 · Oct 18, 2016 · US
Thermal interface materials using metal nanowire arrays and sacrificial templates
US-2016251769-A1 · Sep 1, 2016 · US
High-conductivity bonding of metal nanowire arrays
US-2016250710-A1 · Sep 1, 2016 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Northrop Grumman Systems Corp | 31 |
| Univ Leland Stanford Junior | 7 |
| Northrup Grumman Systems Corp | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W40/258 | 15 |
| H10W40/251 | 13 |
| H10W40/25 | 13 |
| F28F2255/20 | 11 |
| H10W40/70 | 9 |