Cooler and semiconductor device having cooler

Patent metadata

Field	Value
Publication number	US-2016190038-A1
Application number	US-201615066382-A
Country	US
Kind code	A1
Filing date	Mar 10, 2016
Priority date	Mar 14, 2014
Publication date	Jun 30, 2016
Grant date	—

Abstract

A cooler for cooling a semiconductor module includes a top plate; a jacket having a side plate and a bottom plate and firmly fixed to the top plate; a refrigerant inflow port through which a refrigerant flows into a space surrounded by the top plate and jacket; a refrigerant outflow port through which the refrigerant flows out from the space; a plurality of fins firmly fixed to the top plate and disposed separately on each of the left and right relative to a main refrigerant path in the jacket to be inclined toward the inflow side of the main refrigerant path; heat transfer pins disposed on the top plate on the refrigerant inflow sides of the fins; and a curved plate-like bimetal valve having one end connected to each respective heat transfer pin and another free end.

First claim

What is claimed is:

1 . A cooler for cooling a semiconductor module, comprising:
a top plate; a jacket having a bottom plate, a side plate firmly fixed to the top plate, and a main refrigerant path therein; a refrigerant inflow port through which a refrigerant flows into a space surrounded by the top plate and jacket; a refrigerant outflow port through which the refrigerant flows out from the space; a plurality of fins firmly fixed to the top plate and disposed separately on left and right relative to the main refrigerant path in the jacket to be inclined toward an inflow side of the main refrigerant path; heat transfer pins disposed on the top plate on the refrigerant inflow side of the fins; and a curved plate-like bimetal valve having one end connected to each heat transfer pin, and another free end.

2 . The cooler according to claim 1 , wherein an inclination angle of the fin is in a range of 30 degrees or more and 60 degrees or less with respect to the main refrigerant path as a reference.

3 . The cooler according to claim 1 , wherein the refrigerant is a liquid.

4 . The cooler according to claim 3 , further comprising a blocking plate on a downstream side of the main refrigerant path before the refrigerant outflow port.

5 . The cooler according to claim 3 , wherein an installation distance between adjacent heat transfer pins is twice or more as large as a distance between adjacent fins.

6 . The cooler according to claim 3 , wherein the bimetal valve has a structure such that the bimetal valve changes to a first shape, which is curved in a refrigerant inflow direction, and to a second shape which becomes closer to linear as a temperature becomes higher than that in the first shape, and
in the first shape, a distance between the free end of the bimetal valve and the fin adjacent thereto is equal to a distance between adjacent fins.

7 . The cooler according to claim 6 , wherein the bimetal valve includes a first metal piece, and a second metal piece joined together, the second metal piece having expansion coefficient higher than that of the first metal piece,
the first metal piece is an iron-nickel alloy plate, and the second metal piece is formed of one or a plurality of metals selected from the group consisting of manganese, chromium, and copper, added to an iron-nickel alloy plate.

8 . The cooler according to claim 7 , wherein a thickness of the bimetal valve is 0.5 mm or more and 5 mm or less.

9 . A semiconductor device comprising:
the cooler according to claim 3 ; a circuit substrate having an insulating substrate, a circuit portion on an upper surface of the insulating substrate, and a metal portion on a lower surface of the insulating substrate; a semiconductor chip electrically connected to the circuit portion, which is cooled by the cooler; a first external terminal connected to the semiconductor chip; a second external terminal connected to the circuit portion; and a resin portion which houses the circuit substrate, the semiconductor chip, the first external terminal, and the second external terminal, except a surface on an opposite side of the metal portion from the insulating substrate, one end of the first external terminal, and one end of the second external terminal, wherein the plurality of fins is thermally connected to the metal portion, and the heat transfer pins are disposed below the insulating substrate.

10 . The semiconductor device according to claim 9 , further comprising:
a plurality of intermediate assemblies, each having the circuit substrate, the semiconductor chip, the first external terminal, and the second external terminal; a metal base disposed between a plurality of metal portions and the top plate; a first connection member which thermally connects the plurality of metal portions and the metal base; and a second connection member which thermally connects the metal base and top plate.

11 . The semiconductor device according to claim 9 , wherein the top plate is the metal portion.

Assignees

• Fuji Electric Co Ltd

Inventors

• Koyama Takahiro
• Terasawa Noriho

Classifications

• H10W40/255

  having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W74/114

  by a substrate and the encapsulations · CPC title

• H10W70/65

  Shapes or dispositions of interconnections · CPC title

• H10W40/258

  Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title