SiC wafer producing method

Patent metadata

Field	Value
Publication number	US-10155323-B2
Application number	US-201715833556-A
Country	US
Kind code	B2
Filing date	Dec 6, 2017
Priority date	Dec 6, 2016
Publication date	Dec 18, 2018
Grant date	Dec 18, 2018

Abstract

A SiC wafer producing method produces an SiC wafer from a single crystal SiC ingot. The method includes a separation layer forming step of setting a focal point of a pulsed laser beam having a transmission wavelength to single crystal SiC inside the ingot at a predetermined depth from an end surface of the ingot, the predetermined depth corresponding to the thickness of the wafer to be produced, and next applying the pulsed laser beam to the ingot, thereby forming a plurality of modified portions on a c-plane present in the ingot at the predetermined depth and also forming cracks isotropically on the c-plane so as to extend from each modified portion, each modified portion being a region where SiC has been decomposed into Si and C, the modified portions and the cracks constituting a separation layer along which the wafer is to be separated from the ingot.

First claim

What is claimed is:

1. An SiC wafer producing method for producing an SiC wafer from a single crystal SiC ingot having an end surface, a c-axis intersecting said end surface, and a c-plane perpendicular to said c-axis, said SiC wafer producing method comprising:
a separation layer forming step of setting a focal point of a pulsed laser beam having a transmission wavelength to single crystal SiC inside said SiC ingot at a predetermined depth from said end surface, said predetermined depth corresponding to the thickness of said SiC wafer to be produced, and next applying said pulsed laser beam to said SiC ingot, thereby forming a plurality of modified portions on said c-plane at said predetermined depth and also forming a plurality of cracks isotropically formed on said c-plane so as to extend from each modified portion, each modified portion being a region where SiC has been decomposed into Si and C, said modified portions and said cracks constituting a separation layer along which said SiC wafer is to be separated from said SiC ingot; and
a wafer producing step of separating a part of said SiC ingot along said separation layer as an interface, thereby producing said SiC wafer;
said wafer producing step including the steps of immersing said SiC ingot in a liquid and next applying ultrasonic wave through said liquid to said SiC ingot, said ultrasonic wave having a frequency greater than or equal to a critical frequency close to a natural frequency of said SiC ingot.

2. The SiC wafer producing method according to claim 1 , wherein said critical frequency close to the natural frequency of said SiC ingot is 0.8 times the natural frequency of said SiC ingot.

3. The SiC wafer producing method according to claim 1 , wherein said liquid is water, the temperature of said water being set to a temperature at which an occurrence of cavitation is suppressed.

4. The SiC wafer producing method according to claim 3 , wherein the temperature of said water is in the range of 0° C. to 25° C.

5. The SiC wafer producing method according to claim 1 , wherein said c-axis coincides with a normal to said end surface of said SiC ingot;
said separation layer forming step including:
a modified portion forming step of applying said pulsed laser beam to said SIC ingot in a condition where said focal point is set at said predetermined depth as relatively feeding said SiC ingot and said focal point in a feeding direction, thereby continuously forming said modified portions so that any adjacent ones of said modified portions overlap each other in said feeding direction; and
an indexing step of relatively indexing said SiC ingot and said focal point in an indexing direction in the range not greater than the width of said cracks;
said modified portion forming step and said indexing step being alternately performed to form said separation layer, in which said cracks adjacent to each other in said indexing direction are connected.

6. The SiC wafer producing method according to claim 1 , wherein said c-axis is inclined by an off angle with respect to a normal to said end surface of said SiC ingot;
said separation layer forming step including:
a modified portion forming step of applying said pulsed laser beam to said SiC ingot in a condition where said focal point is set at said predetermined depth as relatively feeding said SiC ingot and said focal point in a first direction perpendicular to a second direction where said off angle is formed between said c-plane and said end surface, thereby continuously forming said modified portions so that any adjacent ones of said modified portions overlap each other in said first direction; and
an indexing step of relatively indexing said SiC ingot and said focal point in said second direction in the range not greater than the width of said cracks;
said modified portion forming step and said indexing step being alternately performed to form said separation layer, in which said cracks adjacent to each other in said indexing direction are connected.

Assignees

• Disco Corp

Inventors

• Hirata Kazuya

Classifications

• H10P90/00

  Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement · CPC title

• H01L29/1608

  Electricity · mapped topic

• B26D7/086

  by vibrating, e.g. ultrasonically · CPC title

• B26F3/002 Primary

  Precutting and tensioning or breaking · CPC title

• H10D62/8325

  Silicon carbide · CPC title