Supernucleating multiscale copper surfaces for high performance phase change heat transfer

Patent metadata

Field	Value
Publication number	US-10100411-B2
Application number	US-201715530567-A
Country	US
Kind code	B2
Filing date	Jan 30, 2017
Priority date	Feb 12, 2016
Publication date	Oct 16, 2018
Grant date	Oct 16, 2018

Abstract

A method is provided for forming a biphilic surface on a substrate comprising copper, such as a heat exchanger surface, wherein the method involves forming one or more hydrophilic areas on the surface by reacting those areas with at least one of hydrogen peroxide and ammonium hydroxide to form copper oxide and forming hydrophobic areas on the surface by reacting those areas with ammonium hydroxide solution to form copper hydroxide or by chemical etching with a combination of hydrochloric acid, hydrogen peroxide, and iron chloride. The functional surface can exhibit temporal biphilicity in response to one or more stimuli in high performance heat transfer applications.

First claim

We claim:

1. A method of forming a biphilic surface on a substrate comprising a metal or metal alloy comprising copper, comprising the steps of forming one or more hydrophilic areas on the substrate surface by chemically reacting one or more surface areas with at least one reactant that forms copper oxide and forming hydrophobic areas on the substrate surface by chemically etching one or more other surface areas with a combination of hydrochloric acid and at least one of hydrogen peroxide and ferric chloride.

2. The method of claim 1 wherein the metal or metal alloy comprises copper or copper alloy.

3. The method of claim 1 wherein the hydrophilic areas comprise at least one of Cu 2 O and CuO.

4. The method of claim 1 wherein the hydrophobic areas comprise etched Cu.

5. The method of claim 1 wherein chemical etching produces super-hydrophobic surface areas.

6. A heat exchanger surface having a biphilic surface produced by the method of claim 1 .

7. In a method of pool boiling wherein a heat transfer element is placed between a heat source and liquid, the improvement comprising providing a biphilic surface on the heat transfer element in contact with the liquid wherein the biphilic surface is made using the method of claim 1 to comprise at least one chemically treated hydrophilic surface area and at least one chemically treated hydrophobic surface area.

8. The method of claim 1 wherein the reactant is selected from at least one of hydrogen peroxide, alkali hydroxide, and ammonium hydroxide.

9. A functional metallic surface comprising a metal or a metal alloy having a chemically treated surface microstructure that is switchable between a hydrophilic state and a hydrophobic state in a fluid phase change heat transfer process.

10. The functional metallic surface of claim 9 which reversibly changes from a hydrophobic state or a hydrophilic state, or vice versa.

11. The functional metallic surface of claim 9 which comprises copper or a copper alloy.

12. The functional metallic surface of claim 9 comprising pillars on the chemically treated surface microstructure.

13. The functional metallic surface of claim 9 that comprises an etched copper surface.

14. The functional metallic surface of claim 9 that comprises an etched and oxidized copper surface.

15. A biphilic surface comprising copper including a chemically treated surface having a relatively hydrophobic surface area comprising at least one of copper hydroxide and etched copper and a relatively hydrophilic surface area comprising copper oxide.

16. The surface of claim 15 wherein each surface area includes different tiers of surface features.

17. The surface of claim 16 wherein the surface features comprise pillars.

18. A fluid phase change heat transfer device having a phase change heat transfer metallic surface a having a surface microstructure that is switchable between a hydrophilic state and a hydrophobic state in a fluid and a control device to change the heat transfer surface between the hydrophobic state and the hydrophilic state.

19. The device of claim 18 wherein the heat transfer metallic surface comprises copper or a copper alloy.

20. The device of claim 18 wherein the control device comprises a valve to control fluid pressure.

21. The device of claim 18 wherein the control device comprises a heater to control temperature at the heat transfer metallic surface.

22. The device of claim 18 which is a boiler.

23. The device of claim 18 wherein the heat transfer surface comprises an etched copper surface.

24. The device of claim 18 wherein the heat transfer surface comprises an etched and oxidized copper surface.

25. A method of forming a biphilic surface on a substrate comprising a metal or metal alloy comprising copper, comprising the steps of forming one or more hydrophilic areas on the substrate surface by reacting one or more surface areas with at least one reactant that forms copper oxide and forming hydrophobic areas on the substrate surface by reacting one or more other surface areas with ammonium hydroxide to form copper hydroxide.

26. The method of claim 25 wherein the hydrophilic areas are formed using ammonium hydroxide reacted with the one or more surface areas at a first reaction temperature and the hydrophobic areas are formed using ammonium hydroxide reacted with the one or more other surface areas at a different reaction temperature.

27. The method of claim 25 wherein the hydrophilic areas comprise at least one of Cu 2 O and CuO.

28. The method of claim 25 wherein the hydrophobic areas comprise Cu(OH) 2 .

29. The method of claim 25 wherein the reactant is selected from at least one of hydrogen peroxide, alkali hydroxide, and ammonium hydroxide.

30. A heat exchanger surface having a biphilic surface produced by the method of claim 25 .

Assignees

• Univ Iowa State Res Found Inc

Inventors

• Frankiewicz Christophe
• Attinger Daniel

Classifications

• F28F2245/04

  hydrophobic · CPC title

• F28F2245/02

  hydrophilic · CPC title

• F28F13/185

  Heat-exchange surfaces provided with microstructures or with porous coatings · CPC title

• C23F1/18

  for etching copper or alloys thereof · CPC title

• C23C22/63 Primary

  Treatment of copper or alloys based thereon · CPC title