Electrostatic chuck with independent zone cooling and reduced crosstalk

Patent metadata

Field	Value
Publication number	US-10079165-B2
Application number	US-201414282503-A
Country	US
Kind code	B2
Filing date	May 20, 2014
Priority date	May 20, 2014
Publication date	Sep 18, 2018
Grant date	Sep 18, 2018

Abstract

An electrostatic chuck is described with independent zone cooling that leads to reduced crosstalk. In one example, the chuck includes a puck to carry a substrate for fabrication processes, and a cooling plate fastened to and thermally coupled to the ceramic puck, the cooling plate having a plurality of different independent cooling channels to carry a heat transfer fluid to transfer heat from the cooling plate.

First claim

What is claimed is:

1. An apparatus comprising:
a puck to carry a substrate for fabrication processes;
a base plate;
a plurality of cooling plates wherein each cooling plate has a first side fastened to the base plate wherein each cooling plate has a second side thermally coupled to the puck the opposite the first side, each of the plurality of cooling plates completely separated from one another by one or more gaps, each of the cooling plates having an independent cooling channel to carry a heat transfer fluid to transfer heat from the cooling plate; and
a cover over each of the one or more gaps to provide a flat surface upon which the puck is attached to the plurality of cooling plates.

2. The apparatus of claim 1 , wherein each cooling channel comprises a respective input and output port that is configured to be coupled to a different heat transfer fluid loop.

3. The apparatus of claim 1 , wherein the cooling channels of each cooling plate are defined by the base plate and a respective one of the plurality of the cooling plates, the apparatus further comprising a plurality of seals to seal the cooling channels against the base plate.

4. The apparatus of claim 3 , wherein the base plate has a thermal conductivity less than a thermal conductivity of the cooling plate.

5. The apparatus of claim 1 , wherein the one or more gaps define one or more air gaps to thermally insulate each cooling plate.

6. The apparatus of claim 5 , wherein each cooling plate is independently fastened to the base plate.

7. The apparatus of claim 6 , wherein the cooling plates are attached to the base plate to form concentric rings.

8. The apparatus of claim 6 , wherein the plurality of cooling plates has thermal conductivity greater than a thermal conductivity of the base plate.

9. The apparatus of claim 6 , wherein the base plate is formed of titanium.

10. The apparatus of claim 6 , wherein the plurality of cooling plates includes three concentric cooling plates, each with a different coolant channel, each of the three concentric cooling plates being independently fastened to the base plate so that the portions are isolated from each other by an air gap.

11. The apparatus of claim 1 , further comprising an isolating gasket between the cooling plates.

12. The apparatus of claim 1 , wherein each cooling plate is annular about a common center.

13. The apparatus of claim 1 , wherein the puck is dielectric, the puck further comprising electrodes to electrostatically grip the substrate during the fabrication processes.

14. The apparatus of claim 1 , further comprising a plurality of heat exchangers each coupled to a respective independent cooling channel to receive the heat transfer fluid from an output of the respective cooling channel, to cool the heat transfer fluid, and to supply the heat transfer fluid to an inlet of the respective cooling channel.

15. The apparatus of claim 14 , further comprising a temperature controller to control the heat exchangers to control a temperature set point used by each heat exchanger.

16. The apparatus of claim 1 , further comprising a plurality of heater traces to heat the puck, the puck being for electrostatically gripping the substrate, the substrate being a silicon wafer.

17. The apparatus of claim 1 , further comprising embedded temperature sensors in the puck to detect the temperature of the chuck and wherein the flow of heat transfer fluid is adjusted based on the detected temperature.

18. The apparatus of claim 17 wherein the plurality of cooling plates are concentric and wherein adjusting the flow comprises individually adjusting the temperature of each cooling plate to obtain a desired inner and outer temperature of the puck.

19. The apparatus of claim 1 , wherein each of the plurality of cooling plates are joined together with a ceramic.

20. The apparatus of claim 1 , wherein the plurality of cooling plates is comprises aluminum and the base plate has a thermal conductivity less than a thermal conductivity of the aluminum of the plurality of cooling plates.

Assignees

• Applied Materials Inc

Inventors

• Parkhe Vijay
• Makhratchev Konstantin

Classifications

• H10P72/0602

  Temperature monitoring · CPC title

• H10P72/72

  using electrostatic chucks · CPC title

• H10P72/0434 Primary

  mainly by convection · CPC title

• C23C16/463

  Cooling of the substrate · CPC title

• C23C16/4586

  Elements in the interior of the support, e.g. electrodes, heating or cooling devices · CPC title