Substrate processing apparatus
US-9555437-B2 · Jan 31, 2017 · US
US10032624B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10032624-B2 |
| Application number | US-201615268180-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 16, 2016 |
| Priority date | Oct 4, 2015 |
| Publication date | Jul 24, 2018 |
| Grant date | Jul 24, 2018 |
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A substrate support apparatus is provided. The apparatus includes a circular base plate and one or more spacers disposed about a circumference of the base plate. The spacers may extend from a top surface of the base plate and a ring body may be coupled to the spacers. The ring body may be spaced from the base plate to define apertures between the base plate and the ring body. One or more support posts may be coupled to the base plate and extend therefrom. The support posts may be coupled to the base plate at positions radially inward from an inner surface of the ring body.
Opening claim text (preview).
What is claimed is: 1. A substrate support apparatus, comprising: a circular base plate; one or more spacers disposed about a circumference of the base plate, the spacers extending from a top surface of the base plate; a ring body coupled to the spacers, wherein the ring body is spaced from the base plate to define apertures between the base plate and the ring body; and one or more support posts coupled to the base plate and extending therefrom, wherein the support posts are coupled to the base plate at positions radially inward from an inner surface of the ring body, each support post having a substrate receiving surface, wherein a minimum distance between the ring body and the base plate is less than a height of the support posts. 2. The apparatus of claim 1 , wherein the spacers are formed from a polymeric material. 3. The apparatus of claim 1 , wherein the base plate has a lip, and the support posts are coupled to the base plate at the lip. 4. The apparatus of claim 3 , wherein the spacers are fixed to the base plate by one or more fasteners. 5. The apparatus of claim 1 , wherein the substrate receiving surface is curved. 6. A substrate processing apparatus, comprising: a circular base plate; one or more spacers disposed about the circumference of the base plate, the spacers extending from a top surface of the base plate; a ring body coupled to the spacers, wherein the ring body is spaced from the base plate to define apertures between the base plate and the ring body; one or more support posts coupled to the base plate and extending therefrom, wherein the support posts are coupled to the base plate at positions radially inward from an inner surface of the ring body; and a circular baffle plate coupled to a top surface of the ring body, wherein one or more positioning elements extend from a bottom surface of the baffle plate and the positioning elements are disposed about a circumference of the baffle plate. 7. The apparatus of claim 6 , wherein the spacers are formed from a polymeric material. 8. The apparatus of claim 6 , wherein the base plate has a lip, and the support posts are coupled to the base plate at the lip. 9. The apparatus of claim 8 , wherein the spacers are fixed to the base plate by one or more fasteners. 10. The apparatus of claim 6 , wherein each support post has a substrate receiving surface. 11. The apparatus of claim 10 , wherein the substrate receiving surface is curved. 12. The apparatus of claim 10 , wherein a minimum distance between the ring body and the base plate is less than a height of the support posts. 13. The apparatus of claim 6 , wherein a number of spacers is twice a number of support posts. 14. The apparatus of claim 7 , wherein each support post has a curved substrate receiving surface. 15. A substrate support method, comprising: positioning a substrate, device side down, on one or more support posts coupled to a base plate of a substrate support, wherein a ring body is coupled to the base plate and positioned about a circumference of the substrate; positioning a baffle plate over the substrate and coupling the baffle plate to the ring body; and positioning the substrate, the substrate support, the ring body, and the baffle plate in a processing chamber. 16. The method of claim 15 , wherein positioning the baffle plate over the substrate comprises engaging a plurality of voids in the baffle plate with a robot. 17. The method of claim 16 , wherein the ring body is spaced apart from the base plate. 18. The method of claim 17 , wherein the support posts maintain a separation between the substrate and the ring body.
Cleaning during device manufacture · CPC title
characterised by the mechanical construction of the susceptor, stage or support · CPC title
characterised by a plurality of separate clamping members, e.g. clamping fingers · CPC title
characterised by the construction of the processing chambers, e.g. modular processing chambers · CPC title
for drying · CPC title
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