Device for holding wafer shaped articles

US9418883B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9418883-B2
Application numberUS-201313935068-A
CountryUS
Kind codeB2
Filing dateJul 3, 2013
Priority dateJul 3, 2013
Publication dateAug 16, 2016
Grant dateAug 16, 2016

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A device for holding a wafer-shaped article comprises an annular chuck base body having a plurality of movable contact elements for securing a wafer-shaped article to the annular chuck base body, and a gear mechanism driving the contact elements in unison between a first position and a second position. The annular chuck base body comprises a housing formed from a material that is resistant to attack by strong inorganic acids. The annular chuck base body also comprises a reinforcing ring fitted within the housing and formed from a material whose coefficient of linear thermal expansion is substantially less than that of the housing material.

First claim

Opening claim text (preview).

What is claimed is: 1. A device for holding a wafer-shaped article, comprising an annular chuck base body having a plurality of movable contact elements for securing a wafer-shaped article to said annular chuck base body, and a gear mechanism driving the contact elements in unison between a first position in which they contact a wafer-shaped article positioned on the device, and a second non-contact position, wherein the annular chuck base body comprises a housing formed from a material that is resistant to attack by strong inorganic acids, and wherein said annular chuck base body comprises a reinforcing ring fitted within said housing and formed from a material whose coefficient of linear thermal expansion is substantially less than that of said housing material, said reinforcing ring surrounding an inner edge of said housing. 2. The device according to claim 1 , wherein said housing is formed from a material whose coefficient of linear thermal expansion is at least twice that of said reinforcing ring material. 3. The device according to claim 1 , wherein said gear mechanism and said reinforcing ring are formed from materials whose coefficients of linear thermal expansion differ from one another by not more than 50%. 4. The device according to claim 1 , wherein said gear mechanism and said reinforcing ring are formed from different materials, each of which is a metal. 5. The device according to claim 4 , wherein said gear mechanism is formed from aluminum and said reinforcing ring is formed from stainless steel. 6. The device according to claim 1 , wherein said contact elements are embodied in a circular series of pin assemblies that are conjointly movable from said second position to said first position, and wherein said gear mechanism comprises a gear ring having gear teeth in continuous meshing engagement with gear teeth provided on a base portion of each of said pin assemblies. 7. The device according to claim 6 , wherein said base body carries a plurality of rollers rotatable about axes parallel to the axis of rotation of said base body, each of said rollers being positioned radially outwardly of a corresponding one of said plurality of pin assemblies, with a respective section of gear teeth of said gear ring being positioned therebetween. 8. The device according to claim 7 , wherein each of said rollers comprises an elastically deformable contact material bearing on a surface of said gear ring. 9. The device according to claim 6 , wherein said pin assemblies each comprise a pin projecting from a respective pivotal base along an axis parallel to and offset from a pivot axis of said pivotal base. 10. The device according to claim 6 , wherein said gear ring teeth are formed on a radially inward edge thereof. 11. The device according to claim 6 , wherein said reinforcing ring comprises arcuate guide slots for guiding said gear ring in rotation relative to said annular chuck base body over a predetermined angular range. 12. The device according to claim 1 , wherein said reinforcing ring comprises a multiplicity of threaded bores for receiving correction weights for balancing said annular chuck base body. 13. The device according to claim 1 , wherein said annular chuck base is a magnetic rotor of a magnetic bearing and drive unit, said device further comprising a chamber in which said magnetic rotor is positioned, and said magnetic rotor and drive unit further comprising a stator positioned outside of said chamber and facing said magnetic rotor across a wall of said chamber. 14. The device according to claim 1 , wherein said contact elements depend downwardly from said annular chuck base body, such that a wafer-shaped article is suspended from said annular chuck base body when mounted in said device. 15. The device according to claim 1 , wherein said housing of said annular chuck base body comprises a main section having openings to receive said contact elements, an upper outer section housing magnets, and a lower outer section in which said reinforcing ring is fitted. 16. A device for holding a wafer-shaped article, comprising an annular chuck base body having a plurality of movable contact elements for securing a wafer-shaped article to said annular chuck base body, and a gear mechanism driving the contact elements in unison between a first position in which they contact a wafer-shaped article positioned on the device, and a second non-contact position, wherein the annular chuck base body comprises a housing formed from a material that is resistant to attack by strong inorganic acids, and wherein said annular chuck base body comprises a reinforcing ring fitted within said housing and formed from a material whose coefficient of linear thermal expansion is substantially less than that of said housing material, wherein said reinforcing ring is formed from steel, and wherein said housing is formed from a plastic selected from the group consisting of polytetrafluoroethylene (PTFE), perfluoroalkoxy (PFA), polyphenylenesulfide (PPS), polyetheretherketone (PEEK), polystyrene/polyethylstyrene (PS/PES), ethylene tetrafluoroethylene (ETFE), polyvinylidene fluoride (PVDF), homopolymer of chlorotrifluoroethylene (PCTFE), fluorinated ethylene propylene (FEP), ethylene chlorotrifluoroethylene (ECTFE) and polypropylene (PP). 17. A device for holding a wafer-shaped article, comprising an annular chuck base body having a plurality of movable contact elements for securing a wafer-shaped article to said annular chuck base body, and a gear mechanism driving the contact elements in unison between a first position in which they contact a wafer-shaped article positioned on the device, and a second non-contact position, wherein the annular chuck base body comprises a housing formed from a material that is resistant to attack by strong inorganic acids, and wherein said annular chuck base body comprises a reinforcing ring fitted within said housing and formed from a material whose coefficient of linear thermal expansion is substantially less than that of said housing material, wherein said gear mechanism and said reinforcing ring are formed from a same material. 18. The device according to claim 17 , wherein said gear mechanism and said reinforcing ring are each formed from stainless steel.

Assignees

Inventors

Classifications

  • for drying etching · CPC title

  • for general liquid treatment, e.g. etching followed by cleaning · CPC title

  • characterised by edge clamping, e.g. clamping ring · CPC title

  • characterised by a plurality of separate clamping members, e.g. clamping fingers · CPC title

  • Devices for holding articles during cleaning {(B08B9/42 takes precedence)} · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9418883B2 cover?
A device for holding a wafer-shaped article comprises an annular chuck base body having a plurality of movable contact elements for securing a wafer-shaped article to the annular chuck base body, and a gear mechanism driving the contact elements in unison between a first position and a second position. The annular chuck base body comprises a housing formed from a material that is resistant to a…
Who is the assignee on this patent?
Lam Res Ag
What technology area does this patent fall under?
Primary CPC classification H10P72/7608. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Aug 16 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).