Wave soldering nozzle having automatic adjustable throat width

Patent metadata

Field	Value
Publication number	US-10029326-B2
Application number	US-201615334819-A
Country	US
Kind code	B2
Filing date	Oct 26, 2016
Priority date	Oct 26, 2016
Publication date	Jul 24, 2018
Grant date	Jul 24, 2018

Abstract

A wave soldering machine includes a housing and a conveyor coupled to the housing. The conveyor is configured to deliver a printed circuit board through the housing. The wave soldering machine further includes a wave soldering station coupled to the housing. The wave soldering station includes a reservoir of solder material, and an adjustable wave solder nozzle assembly adapted to create a solder wave. The adjustable wave solder nozzle assembly has a first curve plate and a second curve plate that together define a nozzle. The second curve plate is movable with respect to the first curve plate between a close proximate position in which the second curve plate is proximate the first curve plate and a spaced apart position in which the second curve plate is spaced from the first curve plate to adjust a width of the nozzle.

First claim

What is claimed is:

1. A wave soldering machine to perform a wave soldering operation on a printed circuit board, the wave soldering machine comprising:
a housing;
a conveyor coupled to the housing, the conveyor being configured to deliver a printed circuit board through the housing; and
a wave soldering station coupled to the housing, the wave soldering station including
a reservoir of solder material, and
an adjustable wave solder nozzle assembly adapted to create a solder wave, the adjustable wave solder nozzle assembly having
a first curve plate and a second curve plate that together define a nozzle, the second curve plate being movable with respect to the first curve plate between a close proximate position in which the second curve plate is proximate the first curve plate and a spaced apart position in which the second curve plate is spaced from the first curve plate to adjust a width of the nozzle,
a nozzle core frame secured to the reservoir, the nozzle core frame being configured to fixedly support the first curve plate,
an unload support frame having a first side wall, a second side wall, and a longitudinal support that extends between the first and second side walls, the first and second side walls being secured to the nozzle core frame, the unload support frame being configured to movably support the second curve plate,
an actuating support frame coupled to the unload support frame so that the actuating support frame moves relative to the first and second side walls of the unload support frame, the second curve plate being secured to the actuating support frame,
a first pair of V-shaped wheels secured to one end of the actuating support frame, and a second pair of V-shaped wheels secured to an opposite end of the actuating support frame,
a first V-grooved block secured to the first side wall of the unload support frame, and a second V-grooved block secured to the second side wall of the unload support frame, the V-shaped wheels being received within the V-grooved blocks to provide relative movement of the actuating support frame with respect to the unload support frame, and
an actuator assembly configured to move the actuating support frame, the actuator assembly including an actuator support secured to the reservoir, an actuator secured to and supported by the actuator support, a connecting link secured to the actuating support frame and coupled to the actuator by an actuator block, the actuator being coupled to a controller to control the movement of the actuator.

2. An adjustable wave solder nozzle assembly of a wave soldering station configured to perform a wave soldering operation on a printed circuit board, the adjustable wave solder nozzle assembly comprising:
a first curve plate and a second curve plate that together define a nozzle, the second curve plate being movable with respect to the first curve plate between a close proximate position in which the second curve plate is proximate the first curve plate and a spaced apart position in which the second curve plate is spaced from the first curve plate to adjust a width of the nozzle;
a nozzle core frame secured to a reservoir, the nozzle core frame being configured to fixedly support the first curve plate;
an unload support frame having a first side wall, a second side wall, and a longitudinal support that extends between the first and second side walls, the first and second side walls being secured to the nozzle core frame, the unload support frame being configured to movably support the second curve plate;
an actuating support frame coupled to the unload support frame so that the actuating support frame moves relative to the first and second side walls of the unload support frame, the second curve plate being secured to the actuating support frame;
a first pair of V-shaped wheels secured to one end of the actuating support frame, and a second pair of V-shaped wheels secured to an opposite end of the actuating support frame;
a first V-grooved block secured to the first side wall of the unload support frame, and a second V-grooved block secured to the second side wall of the unload support frame, the V-shaped wheels being received within the V-grooved blocks to provide relative movement of the actuating support frame with respect to the unload support frame; and
an actuator assembly configured to move the actuating support frame, the actuator assembly including an actuator support secured to the reservoir, an actuator secured to and supported by the actuator support, and a connecting link secured to the actuating support frame and coupled to the actuator by an actuator block,
wherein the actuator is coupled to a controller to control the movement of the actuator.

Assignees

• Illinois Tool Works

Inventors

• Dautenhahn Jonathan M
• Hueste Gregory Leo

Classifications

• H05K3/34

  by soldering · CPC title

• B23K1/085

  Wave soldering · CPC title

• B23K3/0638

  for viscous material feeding, e.g. solder paste feeding (B23K3/0623 takes precedence) · CPC title

• B23K1/0016 Primary

  Soldering of electronic components · CPC title

• B23K3/08

  Auxiliary devices therefor · CPC title