Pre-heater latch and seal mechanism for wave solder machine and related method

Patent metadata

Field	Value
Publication number	US-9427819-B2
Application number	US-201514842226-A
Country	US
Kind code	B2
Filing date	Sep 1, 2015
Priority date	Feb 25, 2014
Publication date	Aug 30, 2016
Grant date	Aug 30, 2016

Abstract

A wave solder machine includes a pre-heating station, a wave soldering station, and a conveyor to transport substrates through a tunnel passing through the pre-heating station and the wave soldering station. The tunnel has a substantially oxygen-free environment. The pre-heating station includes a pre-heater including a support frame assembly, and a heater assembly supported by the support frame assembly. The heater assembly is slidably coupled to the support frame assembly between an operational position and a non-operational position. The pre-heater further includes a seal disposed between the heater assembly and the support frame assembly. The seal provides a gas-tight seal when the heater assembly is in the operational position to prevent atmosphere from entering the tunnel thereby preserving the substantially oxygen-free environment within the tunnel.

First claim

What is claimed is:

1. A wave solder machine configured to perform a wave solder operation on an electronic substrate, the wave solder machine comprising:
a pre-heating station configured to heat the electronic substrate;
a wave soldering station configured to attach electronic components to the electronic substrate with solder; and
a conveyor configured to transport substrates through a tunnel passing through the pre-heating station and the wave soldering station,
wherein the pre-heating station includes at least one pre-heater including
a support frame assembly,
a support tray slidably coupled to the support frame assembly, the support tray being movable between a closed position in which the support tray is slid into the support frame assembly and an open position in which the support tray is slid out of the support frame assembly,
a heater disposed in the support tray, and
a latch mechanism configured to releasably secure the support tray in the closed position.

2. The wave solder machine of claim 1 , wherein the support frame assembly includes a pivot bracket secured to the tunnel.

3. The wave solder machine of claim 2 , wherein the support frame assembly further includes two side plates, each side plate being secured at one end thereof to the pivot bracket by a pivot pin.

4. The wave solder machine of claim 3 , wherein the support frame assembly further includes a latch and guide bracket secured to side plates.

5. The wave solder machine of claim 4 , wherein the pre-heater further includes a seal disposed between the heater and the support frame assembly, the seal being compressed when the support tray is in its closed position.

6. The wave solder machine of claim 4 , wherein the support frame assembly further includes two drawer slides, one for each side plate, configured to enable the support tray to slide between its closed and open positions.

7. The wave solder machine of claim 1 , wherein the latch mechanism includes a latch secured to the support frame assembly, the latch mechanism being configured to releasably secure the support tray.

8. The wave solder machine of claim 1 , wherein the support frame assembly further includes a slide catch releasably secured to the support frame assembly, the slide catch being configured to prevent the support tray from accidentally sliding out when the support tray is moved to its open position.

Assignees

• Illinois Tool Works

Inventors

• Dautenhahn Jonathan M

Classifications

• Y10T29/49826

  Assembling or joining · CPC title

• B23K1/008

  Soldering within a furnace (B23K1/012 takes precedence) · CPC title

• H05K3/341 Primary

  Surface mounted components · CPC title

• H05K2203/111

  Preheating, e.g. before soldering · CPC title

• H05K3/34

  by soldering · CPC title