Wave soldering nozzle system and method of wave soldering

Patent metadata

Field	Value
Publication number	US-9370838-B2
Application number	US-201414465559-A
Country	US
Kind code	B2
Filing date	Aug 21, 2014
Priority date	Aug 21, 2014
Publication date	Jun 21, 2016
Grant date	Jun 21, 2016

Abstract

A wave soldering machine includes a housing and a conveyor coupled to the housing. The conveyor is configured to deliver a printed circuit board through the housing. The wave soldering machine further includes a wave soldering station coupled to the housing. The wave soldering station includes a reservoir of solder material, and a wave solder nozzle system adapted to create a solder wave. The wave solder nozzle system has a nozzle frame, and a nozzle plate secured to the nozzle frame. The nozzle plate includes a first zone of openings positioned adjacent a leading edge of the nozzle plate, a second zone of openings positioned proximate a middle of the nozzle plate, and a third zone having no openings positioned adjacent a trailing edge of the nozzle plate.

First claim

What is claimed is:

1. A wave soldering machine to perform a wave soldering operation on a printed circuit board, the wave soldering machine comprising: a housing; a conveyor coupled to the housing, the conveyor being configured to deliver a printed circuit board through the housing; a wave soldering station coupled to the housing, the wave soldering station including a reservoir of solder material, and a wave solder nozzle system adapted to create a solder wave, the wave solder nozzle system having a nozzle frame, and a nozzle plate secured to the nozzle frame, the nozzle plate including a first zone of openings positioned adjacent a leading edge of the nozzle plate, a second zone of openings positioned proximate a middle of the nozzle plate, and a third zone having no openings positioned adjacent a trailing edge of the nozzle plate, the first zone, and the first zone of the nozzle plate including at least eight rows of openings and the second zone includes at least six rows of openings.

2. The wave soldering machine of claim 1 , wherein openings of the second zone of the nozzle plate are spaced from one another a distance of approximately 10 mm and most of the openings of the first zone are spaced from one another a distance of approximately 20 mm.

3. The wave soldering machine of claim 1 , further comprising an exit plate coupled to the nozzle frame adjacent the trailing edge of the nozzle plate.

4. The wave soldering machine of claim 3 , further comprising a dross box coupled to the nozzle frame adjacent the leading edge of the nozzle plate.

5. A wave solder nozzle system adapted to deliver solder material to perform a wave soldering operation on a printed circuit board, the wave solder nozzle system comprising: a nozzle frame; and a nozzle plate secured to the nozzle frame, the nozzle plate including a first zone of openings positioned adjacent a leading edge of the nozzle plate, a second zone of openings positioned proximate a middle of the nozzle plate, and a third zone having no openings positioned adjacent a trailing edge of the nozzle plate, the first zone of the nozzle plate has less openings than the second zone, openings of the second zone of the nozzle plate being spaced closer together than openings of the first zone, and the first zone of the nozzle plate including at least eight rows of openings and the second zone includes at least six rows of openings.

6. The wave solder nozzle system of claim 5 , wherein openings of the second zone of the nozzle plate are spaced from one another a distance of approximately 10 mm and most of the openings of the first zone are spaced from one another a distance of approximately 20 mm.

7. The wave solder nozzle system of claim 5 , further comprising an exit plate coupled to the nozzle frame adjacent the trailing edge of the nozzle plate.

8. The wave solder nozzle system of claim 7 , further comprising a dross box coupled to the nozzle frame adjacent the leading edge of the nozzle plate.

9. A method of improving the flow of solder material out of a wave solder nozzle system of a wave soldering machine in an inert atmosphere, the method comprising: delivering solder material to a wave solder nozzle system; performing a wave soldering operation on a printed circuit board; and improving the flow of solder material over the wave solder nozzle system by providing a nozzle plate through which solder travels, the nozzle plate including a first zone of openings positioned adjacent a leading edge of the nozzle plate, a second zone of openings positioned proximate a middle of the nozzle plate, and a third zone having no openings positioned adjacent a trailing edge of the nozzle plate, the first zone of the nozzle plate has less openings than the second zone, openings of the second zone of the nozzle plate being spaced closer together than openings of the first zone, and the first zone of the nozzle plate including at least eight rows of openings and the second zone includes at least six rows of openings.

10. The method of claim 9 , wherein openings of the second zone of the nozzle plate are spaced from one another a distance of approximately 10 mm and most of the openings of the first zone are spaced from one another a distance of approximately 20 mm.

11. The method of claim 9 , wherein an increased volume of solder in the second zone equalizes the solder flow to produce an even, parallel solder wave across an entire solder contact area while maintaining a six degree, liquid, molten solder plane that is parallel to a six degree plane of the circuit board travel to maximize a circuit board contact length during the wave soldering operation.

Assignees

• Illinois Tool Works

Inventors

• Hueste Gregory Leo

Classifications

• H05K3/3489

  Composition of fluxes; Application thereof; Other processes of activating the contact surfaces · CPC title

• B23K3/0676

  Conveyors therefor · CPC title

• B23K1/0016 Primary

  Soldering of electronic components · CPC title

• B23K1/085

  Wave soldering · CPC title

• H05K13/0465

  by soldering (H05K13/0469 takes precedence) · CPC title