Antenna substrate and electronic device including the same
US-12476387-B2 · Nov 18, 2025 · US
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Yi Moon Hee patents
Yi Moon Hee is listed as an inventor on 23 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Yi Moon Hee |
| Total patents | 23 |
| First publication | Oct 26, 2017 |
| Latest publication | Nov 18, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Antenna substrate and antenna module comprising the same
US-12456811-B2 · Oct 28, 2025 · US
Semiconductor package including heat dissipation structure
US-12293996-B2 · May 6, 2025 · US
Antenna substrate and antenna module comprising the same
US-2024055767-A1 · Feb 15, 2024 · US
Antenna substrate and antenna module comprising the same
US-11831089-B2 · Nov 28, 2023 · US
Antenna substrate and electronic device including the same
US-2023178902-A1 · Jun 8, 2023 · US
Semiconductor package
US-2023170339-A1 · Jun 1, 2023 · US
Substrate structure
US-2022005765-A1 · Jan 6, 2022 · US
Antenna substrate and antenna module comprising the same
US-2021175627-A1 · Jun 10, 2021 · US
Fan-out semiconductor package
US-10332843-B2 · Jun 25, 2019 · US
Recent patents
Latest publications not already listed above.
Fan-out semiconductor package including electromagnetic interference shielding layer
US-10283439-B2 · May 7, 2019 · US
Fan-out semiconductor package
US-10256192-B2 · Apr 9, 2019 · US
Fan-out semiconductor package
US-10199329-B2 · Feb 5, 2019 · US
Fan-out semiconductor package
US-2019013282-A1 · Jan 10, 2019 · US
Fan-out semiconductor package
US-10177103-B1 · Jan 8, 2019 · US
Fan-out semiconductor package
US-2018286790-A1 · Oct 4, 2018 · US
Fan-out semiconductor package
US-10026678-B1 · Jul 17, 2018 · US
Fan-out semiconductor package
US-2018182691-A1 · Jun 28, 2018 · US
Fan-out semiconductor package
US-2018145033-A1 · May 24, 2018 · US
Fan-out semiconductor package
US-2018068952-A1 · Mar 8, 2018 · US
Fan-out semiconductor package
US-2018053732-A1 · Feb 22, 2018 · US
Fan-out semiconductor package
US-9875970-B2 · Jan 23, 2018 · US
Fan-out semiconductor package
US-2017309571-A1 · Oct 26, 2017 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electro Mech | 23 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W70/60 | 17 |
| H10W90/00 | 13 |
| H10W72/241 | 13 |
| H10W70/611 | 13 |
| H10W72/9413 | 12 |