Integration processes utilizing boron-doped silicon materials
US-12334358-B2 · Jun 17, 2025 · US
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Yang Xiawan patents
Yang Xiawan is listed as an inventor on 13 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Yang Xiawan |
| Total patents | 13 |
| First publication | Apr 9, 2015 |
| Latest publication | Jun 17, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Plasma etching in semiconductor processing
US-2025062131-A1 · Feb 20, 2025 · US
Methods of etching oxygen-containing features at low temperatures
US-2025054770-A1 · Feb 13, 2025 · US
Methods of etching carbon-containing features at low temperatures
US-2025054768-A1 · Feb 13, 2025 · US
Boron nitride for mask patterning
US-11935751-B2 · Mar 19, 2024 · US
Boron nitride for mask patterning
US-2022384189-A1 · Dec 1, 2022 · US
Amorphous carbon multilayer coating with directional protection
US-11437230-B2 · Sep 6, 2022 · US
Integration processes utilizing boron-doped silicon materials
US-2022020599-A1 · Jan 20, 2022 · US
Amorphous carbon multilayer coating with directional protection
US-2021313166-A1 · Oct 7, 2021 · US
Method of matching two or more plasma reactors
US-9305748-B2 · Apr 5, 2016 · US
Recent patents
Latest publications not already listed above.
Predictive method of matching two plasma reactors
US-9184021-B2 · Nov 10, 2015 · US
Method of matching two or more plasma reactors
US-2015096959-A1 · Apr 9, 2015 · US
Predictive method of matching two plasma reactors
US-2015099314-A1 · Apr 9, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Applied Materials Inc | 13 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P14/6336 | 7 |
| H10P76/405 | 6 |
| H10P50/73 | 5 |
| H10P76/4085 | 4 |
| H10P50/283 | 4 |