Method and apparatus for etching a carbon containing layer
US-2024379375-A1 · Nov 14, 2024 · US
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Yan Haoquan patents
Yan Haoquan is listed as an inventor on 17 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Yan Haoquan |
| Total patents | 17 |
| First publication | Jul 21, 2016 |
| Latest publication | Nov 14, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Edge ring arrangement with moveable edge rings
US-2024355667-A1 · Oct 24, 2024 · US
Vacuum pump protection against deposition byproduct buildup
US-12087561-B2 · Sep 10, 2024 · US
Edge ring arrangement with moveable edge rings
US-12027410-B2 · Jul 2, 2024 · US
Vacuum pump protection against deposition byproduct buildup
US-2023317437-A1 · Oct 5, 2023 · US
Vacuum pump protection against deposition byproduct buildup
US-11710623-B2 · Jul 25, 2023 · US
Vacuum pump protection against deposition byproduct buildup
US-2021257195-A1 · Aug 19, 2021 · US
Edge ring arrangement with moveable edge rings
US-2021183687-A1 · Jun 17, 2021 · US
Vacuum pump protection against deposition byproduct buildup
US-11031215-B2 · Jun 8, 2021 · US
Moveable edge coupling ring for edge process control during semiconductor wafer processing
US-10658222-B2 · May 19, 2020 · US
Recent patents
Latest publications not already listed above.
Vacuum pump protection against deposition byproduct buildup
US-2020105509-A1 · Apr 2, 2020 · US
Edge ring centering method using ring dynamic alignment data
US-10541168-B2 · Jan 21, 2020 · US
Edge ring focused deposition during a cleaning process of a processing chamber
US-2019341275-A1 · Nov 7, 2019 · US
Moveable edge ring design
US-2019013232-A1 · Jan 10, 2019 · US
Edge ring centering method using ring dynamic alignment data
US-2018138069-A1 · May 17, 2018 · US
Methods of fabricating nanostructures and nanowires and devices fabricated therefrom
US-9881999-B2 · Jan 30, 2018 · US
Moveable edge coupling ring for edge process control during semiconductor wafer processing
US-2016211166-A1 · Jul 21, 2016 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Lam Res Corp | 16 |
| Majumdar Arun | 1 |
| Shakouri Ali | 1 |
| Sands Timothy D | 1 |
| Yang Peidong | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P72/0421 | 13 |
| H01J37/32715 | 12 |
| H01L21/67069 | 12 |
| H10P72/7611 | 8 |
| H10P72/7612 | 8 |