Hybrid interconnect for laser bonding using nanoporous metal tips
US-2023352437-A1 · Nov 2, 2023 · US
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Wu Jeb patents
Wu Jeb is listed as an inventor on 28 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Wu Jeb |
| Total patents | 28 |
| First publication | Aug 8, 2017 |
| Latest publication | Nov 2, 2023 |
Notable patents
Publications ranked by popularity score, then publication date.
Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heating
US-11735689-B2 · Aug 22, 2023 · US
Selectively bonding light-emitting devices via a pulsed laser
US-2023253524-A1 · Aug 10, 2023 · US
Employing deformable contacts and pre-applied underfill for bonding LED devices via lasers
US-11575069-B2 · Feb 7, 2023 · US
Curing pre-applied and plasma-etched underfill via a laser
US-11563142-B2 · Jan 24, 2023 · US
Selectively bonding light-emitting devices via a pulsed laser
US-11557692-B2 · Jan 17, 2023 · US
Curing pre-applied and laser-ablated underfill via a laser
US-2022393060-A1 · Dec 8, 2022 · US
Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heating
US-2022352412-A1 · Nov 3, 2022 · US
Hybrid interconnect for laser bonding using nanoporous metal tips
US-11424214-B1 · Aug 23, 2022 · US
Interconnect with nanotube fitting
US-11417792-B1 · Aug 16, 2022 · US
Recent patents
Latest publications not already listed above.
Display device and its process for curing post-applied underfill material and bonding packaging contacts via pulsed lasers
US-11404600-B2 · Aug 2, 2022 · US
Transparent circuit boards with multilayered traces
US-11391967-B1 · Jul 19, 2022 · US
Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heating
US-11374148-B2 · Jun 28, 2022 · US
Flexible interconnect using conductive adhesive
US-11349053-B1 · May 31, 2022 · US
Magnetic clamping interconnects
US-11296268-B1 · Apr 5, 2022 · US
Bonding dummy electrodes of light emitting diode chip to substrate
US-11276672-B1 · Mar 15, 2022 · US
Bonding corners of light emitting diode chip to substrate using laser
US-11255529-B1 · Feb 22, 2022 · US
Curved pillar interconnects
US-11239400-B1 · Feb 1, 2022 · US
Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heating
US-2020395520-A1 · Dec 17, 2020 · US
Curing pre-applied and plasma-etched underfill via a laser
US-2020395519-A1 · Dec 17, 2020 · US
Selectively bonding light-emitting devices via a pulsed laser
US-2020395521-A1 · Dec 17, 2020 · US
Employing deformable contacts and pre-applied underfill for bonding led devices via lasers
US-2020395504-A1 · Dec 17, 2020 · US
Curing pre-applied and laser-ablated underfill via a laser
US-2020395503-A1 · Dec 17, 2020 · US
Hololens light engine with linear array imagers and mems
US-2019098267-A1 · Mar 28, 2019 · US
Display device with optics for brightness uniformity tuning having DOE optically coupled to receive light at central and peripheral regions
US-10162181-B2 · Dec 25, 2018 · US
Light engine with lenticular microlenslet arrays
US-10088689-B2 · Oct 2, 2018 · US
Display Module with Particulate Getter for a Near-Eye Display Device
US-2018259767-A1 · Sep 13, 2018 · US
Left and right eye optical paths with shared optical element for head-mounted display device
US-9726891-B2 · Aug 8, 2017 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Facebook Tech Llc | 20 |
| Meta Platforms Tech Llc | 9 |
| Microsoft Technology Licensing Llc | 5 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G02B27/0172 | 23 |
| H10W90/00 | 22 |
| H10H20/0364 | 22 |
| H10H20/857 | 22 |
| G02B2027/0178 | 20 |