Endpoint detection and tracking of photoresist processes
US-2026024735-A1 · Jan 22, 2026 · US
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Wise Richard patents
Wise Richard is listed as an inventor on 67 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Wise Richard |
| Total patents | 67 |
| First publication | Nov 15, 2016 |
| Latest publication | Jan 22, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Tin oxide films in semiconductor device manufacturing
US-12437995-B2 · Oct 7, 2025 · US
Tin oxide films in semiconductor device manufacturing
US-12417916-B2 · Sep 16, 2025 · US
Integrated dry processes for patterning radiation photoresist patterning
US-2025246460-A1 · Jul 31, 2025 · US
Eliminating yield impact of stochastics in lithography
US-12315727-B2 · May 27, 2025 · US
Integrated dry processes for patterning radiation photoresist patterning
US-12278125-B2 · Apr 15, 2025 · US
Tin oxide mandrels in patterning
US-2025087498-A1 · Mar 13, 2025 · US
Integrated dry processes for patterning radiation photoresist patterning
US-12183604-B2 · Dec 31, 2024 · US
Tin oxide mandrels in patterning
US-12183589-B2 · Dec 31, 2024 · US
Atomic layer etch and selective deposition process for extreme ultraviolet lithography resist improvement
US-2024429045-A1 · Dec 26, 2024 · US
Recent patents
Latest publications not already listed above.
Tin oxide films in semiconductor device manufacturing
US-12094711-B2 · Sep 17, 2024 · US
Atomic layer etch and selective deposition process for extreme ultraviolet lithography resist improvement
US-12062538-B2 · Aug 13, 2024 · US
Chamfer-less via integration scheme
US-2024263301-A1 · Aug 8, 2024 · US
Tin oxide thin film spacers in semiconductor device manufacturing
US-12051589-B2 · Jul 30, 2024 · US
Chamfer-less via integration scheme
US-11987876-B2 · May 21, 2024 · US
Integrated dry processes for patterning radiation photoresist patterning
US-2024145272-A1 · May 2, 2024 · US
Tin oxide thin film spacers in semiconductor device manufacturing
US-2024030031-A1 · Jan 25, 2024 · US
Tin oxide thin film spacers in semiconductor device manufacturing
US-11784047-B2 · Oct 10, 2023 · US
Method of forming photo-sensitive hybrid films
US-2023314946-A1 · Oct 5, 2023 · US
Integrated dry processes for patterning radiation photoresist patterning
US-2023290657-A1 · Sep 14, 2023 · US
Integrated dry processes for patterning radiation photoresist patterning
US-2023045336-A1 · Feb 9, 2023 · US
Tin oxide films in semiconductor device manufacturing
US-2022270877-A1 · Aug 25, 2022 · US
Atomic layer etch and selective deposition process for extreme ultraviolet lithography resist improvement
US-2022216050-A1 · Jul 7, 2022 · US
Tin oxide mandrels in patterning
US-11355353-B2 · Jun 7, 2022 · US
Tin oxide films in semiconductor device manufacturing
US-2022165571-A1 · May 26, 2022 · US
Tin oxide films in semiconductor device manufacturing
US-11322351-B2 · May 3, 2022 · US
Eliminating yield impact of stochastics in lithography
US-2022122846-A1 · Apr 21, 2022 · US
Eliminating yield impact of stochastics in lithography
US-11257674-B2 · Feb 22, 2022 · US
Tin oxide thin film spacers in semiconductor device manufacturing
US-2022005694-A1 · Jan 6, 2022 · US
Tin oxide thin film spacers in semiconductor device manufacturing
US-11183383-B2 · Nov 23, 2021 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Lam Res Corp | 64 |
| IBM | 3 |
| Lan Res Corporation | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P50/285 | 50 |
| H10P76/4085 | 39 |
| H01L21/31122 | 37 |
| H01L21/0337 | 36 |
| H10P50/242 | 35 |