Method for forming a via hole self-aligned with a metal block on a substrate
US-11270912-B2 · Mar 8, 2022 · US
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Wilson Christopher patents
Wilson Christopher is listed as an inventor on 11 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Wilson Christopher |
| Total patents | 11 |
| First publication | Sep 7, 2017 |
| Latest publication | Mar 8, 2022 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor fabrication method for producing nano-scaled electrically conductive lines
US-11264271-B2 · Mar 1, 2022 · US
Semiconductor Fabrication Method for Producing Nano-Scaled Electrically Conductive Lines
US-2021193512-A1 · Jun 24, 2021 · US
Method for Forming a Via Hole Self-aligned with a Metal Block on a Substrate
US-2021183698-A1 · Jun 17, 2021 · US
Method for forming a multi-level interconnect structure
US-10763159-B2 · Sep 1, 2020 · US
Method for forming a multi-level interconnect structure
US-2020027780-A1 · Jan 23, 2020 · US
Method of patterning target layer
US-10395978-B2 · Aug 27, 2019 · US
Method for interrupting a line in an interconnect
US-10242907-B2 · Mar 26, 2019 · US
Method of patterning target layer
US-2018247863-A1 · Aug 30, 2018 · US
Self-aligned interconnects
US-9859161-B2 · Jan 2, 2018 · US
Recent patents
Latest publications not already listed above.
Self-aligned interconnects
US-2017256451-A1 · Sep 7, 2017 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Imec Vzw | 11 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W20/089 | 9 |
| H01L21/76816 | 9 |
| H10P76/4085 | 5 |
| H01L21/0337 | 5 |
| H10W20/077 | 4 |