Vapor chamber
US-2026075768-A1 · Mar 12, 2026 · US
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Watanabe Yosuke patents
Watanabe Yosuke is listed as an inventor on 94 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Watanabe Yosuke |
| Total patents | 94 |
| First publication | Jun 30, 2015 |
| Latest publication | Mar 12, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor device and method of manufacturing the same
US-2026047112-A1 · Feb 12, 2026 · US
Antibody variant and isoform with lowered biological activity
US-2025382390-A1 · Dec 18, 2025 · US
Vapor chamber
US-12501582-B2 · Dec 16, 2025 · US
Robot component module, robot
US-12496717-B2 · Dec 16, 2025 · US
Film forming method and film forming apparatus
US-2025313932-A1 · Oct 9, 2025 · US
Film forming method
US-2025316477-A1 · Oct 9, 2025 · US
Method for operating film forming device and film forming device
US-2025313933-A1 · Oct 9, 2025 · US
Antibody variant and isoform with lowered biological activity
US-12421322-B2 · Sep 23, 2025 · US
Semiconductor device
US-2025293151-A1 · Sep 18, 2025 · US
Recent patents
Latest publications not already listed above.
Heat transport device
US-12398957-B2 · Aug 26, 2025 · US
Heat sink
US-12372309-B2 · Jul 29, 2025 · US
Noise suppression tape
US-12356598-B2 · Jul 8, 2025 · US
Heat sink
US-12295121-B2 · May 6, 2025 · US
Filter circuit
US-2025119119-A1 · Apr 10, 2025 · US
Two-part thermally conductive resin composition and cured product
US-2025101219-A1 · Mar 27, 2025 · US
Right angle type connector and noise reduction part
US-2025096507-A1 · Mar 20, 2025 · US
Heat sink
US-2025089217-A1 · Mar 13, 2025 · US
Carbon film deposition method and deposition apparatus
US-12217956-B2 · Feb 4, 2025 · US
Heat transport device
US-2024410657-A1 · Dec 12, 2024 · US
Line narrowing gas laser device and electronic device manufacturing method
US-12155168-B2 · Nov 26, 2024 · US
Robot component module, robot
US-2024342908-A1 · Oct 17, 2024 · US
Switch drive device
US-2024283446-A1 · Aug 22, 2024 · US
Heat sink
US-2024260234-A1 · Aug 1, 2024 · US
Method for depositing boron nitride film and film deposition apparatus
US-12049694-B2 · Jul 30, 2024 · US
Culture device and culture method
US-2024174965-A1 · May 30, 2024 · US
Film forming method and film forming apparatus
US-2024128081-A1 · Apr 18, 2024 · US
Noise reduction element
US-11875923-B2 · Jan 16, 2024 · US
Film deposition method and film deposition apparatus
US-2024014031-A1 · Jan 11, 2024 · US
Film forming method
US-2023420249-A1 · Dec 28, 2023 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Furukawa Electric Co Ltd | 23 |
| Tokyo Electron Ltd | 18 |
| Mitsubishi Electric Corp | 11 |
| Denso Corp | 6 |
| Canon Kk | 5 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W40/73 | 17 |
| H05K7/20336 | 17 |
| F28D15/0233 | 15 |
| F28D15/0275 | 14 |
| F28D15/046 | 12 |