Electronic device, carrying buckle, and carrying frame of carrying buckle
US-12582202-B2 · Mar 24, 2026 · US
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Wang Yi-Chieh patents
Wang Yi-Chieh is listed as an inventor on 22 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Wang Yi-Chieh |
| Total patents | 22 |
| First publication | Feb 17, 2015 |
| Latest publication | Mar 24, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Electronic package and manufacturing method thereof
US-2025087635-A1 · Mar 13, 2025 · US
Electronic package and fabricating method thereof
US-2024266335-A1 · Aug 8, 2024 · US
Electronic device, carrying buckle, and carrying frame of carrying buckle
US-2024065388-A1 · Feb 29, 2024 · US
Semiconductor device
US-11804526-B2 · Oct 31, 2023 · US
Semiconductor device
US-11798998-B2 · Oct 24, 2023 · US
Semiconductor device
US-11791386-B2 · Oct 17, 2023 · US
Connector combination structure and connector thereof
US-11637399-B2 · Apr 25, 2023 · US
Semiconductor device
US-2022406904-A1 · Dec 22, 2022 · US
Semiconductor device
US-2022406902-A1 · Dec 22, 2022 · US
Recent patents
Latest publications not already listed above.
Semiconductor device
US-2022406903-A1 · Dec 22, 2022 · US
Semiconductor device
US-11462621-B2 · Oct 4, 2022 · US
Semiconductor device
US-2022254888-A1 · Aug 11, 2022 · US
Connector combination structure and connector thereof
US-2022216648-A1 · Jul 7, 2022 · US
Cathode assembly, physical vapor deposition system, and method for physical vapor deposition
US-10804083-B2 · Oct 13, 2020 · US
Method and structure for nitrogen-doped shallow-trench isolation dielectric
US-9460957-B2 · Oct 4, 2016 · US
Assembly structure for connecting multiple dies into a system-in-package chip and the method thereof
US-9349610-B2 · May 24, 2016 · US
Cathode assembly, physical vapor deposition system, and method for physical vapor deposition
US-2016013032-A1 · Jan 14, 2016 · US
Assembly structure for connecting multiple dies into a system-in-package chip and the method thereof
US-2015311094-A1 · Oct 29, 2015 · US
Assembly structure for connecting multiple dies into a system-in-package chip and the method thereof
US-9111846-B1 · Aug 18, 2015 · US
Decoupling circuit and antenna device
US-9059509-B2 · Jun 16, 2015 · US
Decoupling circuit and antenna device
US-8957825-B2 · Feb 17, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| United Microelectronics Corp | 8 |
| Wistron Neweb Corp | 6 |
| Wang Yi-Chieh | 4 |
| Taiwan Semiconductor Mfg Co Ltd | 3 |
| Whang Tsung Chuan | 3 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10D84/83 | 8 |
| H10D30/65 | 8 |
| H10D64/112 | 8 |
| H10D62/127 | 8 |
| H10D84/835 | 8 |