Assembly structure for connecting multiple dies into a system-in-package chip and the method thereof
US-9349610-B2 · May 24, 2016 · US
This page is not indexed by search engines while we improve data quality.
Wang Yi-Chieh patents
Wang Yi-Chieh holds 4 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 4 |
| Recent patents | 0 |
| First publication | Jun 16, 2015 |
| Latest publication | May 24, 2016 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Assembly structure for connecting multiple dies into a system-in-package chip and the method thereof
US-2015311094-A1 · Oct 29, 2015 · US
Assembly structure for connecting multiple dies into a system-in-package chip and the method thereof
US-9111846-B1 · Aug 18, 2015 · US
Decoupling circuit and antenna device
US-9059509-B2 · Jun 16, 2015 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Assembly structure for connecting multiple dies into a system-in-package chip and the method thereof
US-9349610-B2 · May 24, 2016 · US
Assembly structure for connecting multiple dies into a system-in-package chip and the method thereof
US-2015311094-A1 · Oct 29, 2015 · US
Assembly structure for connecting multiple dies into a system-in-package chip and the method thereof
US-9111846-B1 · Aug 18, 2015 · US
Decoupling circuit and antenna device
US-9059509-B2 · Jun 16, 2015 · US
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 4 |