Electronic device
US-2026079045-A1 · Mar 19, 2026 · US
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Wang Cheng-Chi patents
Wang Cheng-Chi is listed as an inventor on 104 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Wang Cheng-Chi |
| Total patents | 104 |
| First publication | Nov 26, 2015 |
| Latest publication | Mar 19, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor device and manufacturing method thereof
US-2026068764-A1 · Mar 5, 2026 · US
Semiconductor device
US-12550760-B2 · Feb 10, 2026 · US
Electronic device and manufacturing method thereof
US-12538831-B2 · Jan 27, 2026 · US
Electronic device and related tiled electronic device
US-12504323-B2 · Dec 23, 2025 · US
Manufacturing method of package structure of electronic device
US-2025372406-A1 · Dec 4, 2025 · US
Semiconductor package device having at least one second metal line between two adjacent first metal lines of redistribution layer
US-12489048-B2 · Dec 2, 2025 · US
Electronic device and method of fabricating an electronic device
US-12482778-B2 · Nov 25, 2025 · US
Composite layer circuit element
US-12424454-B2 · Sep 23, 2025 · US
Manufacturing method of package structure of electronic device
US-12424458-B2 · Sep 23, 2025 · US
Recent patents
Latest publications not already listed above.
Electronic device and method of forming electronic device
US-12408269-B2 · Sep 2, 2025 · US
Package structure
US-2025273551-A1 · Aug 28, 2025 · US
Method for manufacturing an electronic device
US-2025253190-A1 · Aug 7, 2025 · US
Manufacturing method of electronic device
US-2025246487-A1 · Jul 31, 2025 · US
Method for manufacturing electronic device
US-12374560-B2 · Jul 29, 2025 · US
Method for manufacturing electronic device
US-12368079-B2 · Jul 22, 2025 · US
Redistribution layer structure
US-12322686-B2 · Jun 3, 2025 · US
Electronic device and method for forming the same
US-2025168981-A1 · May 22, 2025 · US
Electronic device and manufacturing method thereof
US-12308296-B2 · May 20, 2025 · US
Method for manufacturing an electronic device
US-12308289-B2 · May 20, 2025 · US
Manufacturing method of package device
US-2025157904-A1 · May 15, 2025 · US
Electronic device and manufacturing method thereof
US-2025140671-A1 · May 1, 2025 · US
Electronic device
US-2025140645-A1 · May 1, 2025 · US
Electronic device
US-2025089164-A1 · Mar 13, 2025 · US
Electronic device and method of manufacturing the same
US-2025081354-A1 · Mar 6, 2025 · US
Electronic device and method for forming the same
US-12238863-B2 · Feb 25, 2025 · US
Package device
US-12230558-B2 · Feb 18, 2025 · US
Electronic device
US-12224226-B2 · Feb 11, 2025 · US
Method for manufacturing electronic device
US-2025046623-A1 · Feb 6, 2025 · US
Electronic device
US-2025038089-A1 · Jan 30, 2025 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Innolux Corp | 100 |
| Academia Sinica | 4 |
| Univ Yuan Ze | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W70/05 | 51 |
| H10W70/685 | 43 |
| H10W70/65 | 43 |
| H10P72/74 | 42 |
| H10P72/7424 | 40 |