Electronic device and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-12308296-B2
Application number	US-202117528167-A
Country	US
Kind code	B2
Filing date	Nov 16, 2021
Priority date	Aug 5, 2021
Publication date	May 20, 2025
Grant date	May 20, 2025

Abstract

The present disclosure provides an electronic device and a manufacturing method thereof. The electronic device includes a connecting element. The connecting element includes a first conductive line segment, a second conductive line segment, and a first connecting line segment. The first conductive line segment is electrically connected to the second conductive line segment through the first connecting line segment. In a vertical projection direction, the first connecting line segment has a first height, the first conductive line segment has a second height, and the first height is different from the second height.

First claim

What is claimed is:

1. An electronic device, comprising:
a connecting element comprising:
a first conductive line segment;
a second conductive line segment; and
a first connecting line segment, wherein the first conductive line segment is electrically connected to the second conductive line segment through the first connecting line segment,
wherein in a vertical projection direction, the first connecting line segment has a first height, the first conductive line segment has a second height, and the first height is different from the second height,
wherein in a top view of the electronic device, the first conductive line segment and the first connecting line segment extends along a first direction, a connection portion of the first connecting line segment connecting to the first conductive line segment has an arc-shaped edge, a line width of the first connecting line segment in a second direction is larger than a line width of the first conductive line segment in the second direction, and the second direction is perpendicular to the first direction.

2. The electronic device according to claim 1 , wherein a ratio of the first height to the second height is greater than 1 and less than or equal to 2.2.

3. The electronic device according to claim 1 , wherein a surface roughness of the first connecting line segment is different from a surface roughness of the first conductive line segment or the second conductive line segment.

4. The electronic device according to claim 1 , wherein a portion of the first connecting line segment covers a surface of the first conductive line segment, the portion of the first connecting line segment has a side surface, an included angle is disposed between the side surface and the surface of the first conductive line segment, and the included angle is greater than or equal to 30 degrees and less than 90 degrees.

5. The electronic device according to claim 1 , wherein the first connecting line segment comprises:
a first portion, disposed between the first conductive line segment and the second conductive line segment, wherein the first portion has a first width;
a second portion, disposed on the first portion;
a third portion, partially covering a surface of the first conductive line segment; and
a fourth portion, partially covering a surface of the second conductive line segment,
wherein the second portion is disposed between the third portion and the fourth portion, the third portion has a second width, and a ratio of the second width to the first width is greater than 0 and less than or equal to 0.1.

6. The electronic device according to claim 1 , further comprising a protective layer covering the first connecting line segment.

7. The electronic device according to claim 6 , wherein the protective layer has an upper surface, and the upper surface has a curved corner.

8. The electronic device according to claim 6 , wherein a portion of the first connecting line segment is higher than the first conductive line segment and the second conductive line segment, the portion of the first connecting line segment has a third width, the protective layer has a fourth width, and a ratio of the fourth width to the third width is greater than or equal to 1 and less than or equal to 1.3.

9. The electronic device according to claim 1 , wherein an oxygen content of the first connecting line segment is different from an oxygen content of the first conductive line segment or the second conductive line segment.

10. The electronic device according to claim 1 , wherein a carbon content of the first connecting line segment is different from a carbon content of the first conductive line segment or the second conductive line segment.

Assignees

• Innolux Corp

Inventors

• Wang Cheng-Chi
• Fan Kuang-Ming
• Chen Liang-Lu
• Yang Chia-Lin

Classifications

• H10W70/60

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title

• H10W70/09 Primary

  extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs · CPC title

• H10W70/6528

  of the portions that connect to chips, wafers or package parts · CPC title

• H10W90/701

  characterised by the relative positions of pads or connectors relative to package parts · CPC title

• H10W70/685

  comprising multiple insulating layers · CPC title