Redistribution layer structure

Patent metadata

Field	Value
Publication number	US-12322686-B2
Application number	US-202117531777-A
Country	US
Kind code	B2
Filing date	Nov 21, 2021
Priority date	Dec 15, 2020
Publication date	Jun 3, 2025
Grant date	Jun 3, 2025

Abstract

A redistribution layer structure is provided. The redistribution layer structure includes a first metal layer, a first dielectric layer disposed on the first metal layer, a second metal layer disposed on the first dielectric layer, and a second dielectric layer disposed on the second metal layer. A coefficient of thermal expansion of the first dielectric layer is less than a coefficient of thermal expansion of the second dielectric layer.

First claim

What is claimed is:

1. A package structure, comprising:
a glass substrate;
a redistribution layer structure disposed on the glass substrate; and
an electronic component disposed on the redistribution layer structure,
wherein the redistribution layer structure comprising:
a first metal layer disposed on the glass substrate;
a first dielectric layer disposed on the first metal layer;
a second metal layer disposed on the first dielectric layer;
a second dielectric layer disposed on the second metal layer;
a third metal layer disposed on the second dielectric layer;
a third dielectric layer disposed on the third metal layer;
a fourth metal layer disposed on the third dielectric layer; and
a fourth dielectric layer disposed on the fourth metal layer,

wherein, a coefficient of thermal expansion of the first dielectric layer is less than a coefficient of thermal expansion of the second dielectric layer, the coefficient of thermal expansion of the second dielectric layer is less than a coefficient of thermal expansion of the third dielectric layer, and the coefficient of thermal expansion of the third dielectric layer is less than a coefficient of thermal expansion of the fourth dielectric layer,
wherein a thickness of the first dielectric layer is greater than a thickness of the second dielectric layer, and the thickness of the second dielectric layer is greater than a thickness of the third dielectric layer.

2. The package structure according to claim 1 , wherein the thickness of the first dielectric layer is 11 μm to 19 μm.

3. The package structure of claim 1 , wherein a Young's modulus of the first dielectric layer is 3 GPa to 5 GPa.

4. The package structure of claim 1 , wherein the coefficient of thermal expansion of the first dielectric layer is 20 ppm/° C. to 40 ppm/° C.

5. The package structure according to claim 1 , wherein the thickness of the second dielectric layer is 9 μm to 11 μm.

6. The package structure according to claim 1 , wherein a thickness of the first metal layer is 4 μm to 13 μm.

7. The package structure of claim 1 , wherein a Young's modulus of the first metal layer is 90 GPa to 120 GPa.

8. The package structure of claim 1 , wherein a coefficient of thermal expansion of the first metal layer is 16 ppm/° C. to 20 ppm/° C.

9. The package structure according to claim 1 , further comprising:
a top connector disposed on the fourth dielectric layer, and the top connector is electrically connected to the fourth metal layer.

10. The package structure according to claim 1 , wherein the glass substrate comprises an electronic component and an encapsulation material.

11. The package structure according to claim 1 , further comprising a debonding layer disposed between the glass substrate and the redistribution layer structure.

Assignees

• Innolux Corp

Inventors

• Chou Hung-Sheng
• Liao Wen-Hsiang
• Fan Kuo-Jung
• Yeh Heng-Shen
• Wang Cheng-Chi

Classifications

• H10P72/7424

  used as a support during the manufacture of self-supporting substrates · CPC title

• H10P72/74

  using temporarily an auxiliary support · CPC title

• H10W70/05

  of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04) · CPC title

• H10W70/614

  the multiple chips being integrally enclosed · CPC title

• H10W70/695

  Organic materials · CPC title