Electronic substrates having embedded inductors
US-12573536-B2 · Mar 10, 2026 · US
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Wall Marcel patents
Wall Marcel is listed as an inventor on 46 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Wall Marcel |
| Total patents | 46 |
| First publication | Oct 17, 2019 |
| Latest publication | Mar 10, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Surface functionalization of sinx thin film by wet etching for improved adhesion of metal-dielectric for HSIO
US-12568817-B2 · Mar 3, 2026 · US
Glass core edge treatments for hybrid panels in device packaging
US-2026005082-A1 · Jan 1, 2026 · US
Electroless plating process
US-12416093-B2 · Sep 16, 2025 · US
Capacitors in through glass vias
US-12349282-B2 · Jul 1, 2025 · US
Passivation boundary defects for reduced leakage current capacitor dielectric materials
US-2025210506-A1 · Jun 26, 2025 · US
Carbon nanofiber capacitor apparatus and related methods
US-2025006781-A1 · Jan 2, 2025 · US
Hybrid metallization surfaces for integrated circuit packages
US-2025006616-A1 · Jan 2, 2025 · US
Through glass vias with compliant layer for integrated circuit device packages
US-2025006646-A1 · Jan 2, 2025 · US
Dielectric-to-metal adhesion promotion material
US-12159825-B2 · Dec 3, 2024 · US
Recent patents
Latest publications not already listed above.
Glass-integrated inductors in integrated circuit packages
US-2024332100-A1 · Oct 3, 2024 · US
Electronic substrates having embedded inductors
US-2024331921-A1 · Oct 3, 2024 · US
Photonic integrated circuit packages and methods of manufacturing the same
US-2024321657-A1 · Sep 26, 2024 · US
Electronic substrates having embedded inductors
US-12057252-B2 · Aug 6, 2024 · US
Selectively roughened copper architectures for low insertion loss conductive features
US-12033930-B2 · Jul 9, 2024 · US
Substrate package-integrated oxide capacitors and related methods
US-2024222018-A1 · Jul 4, 2024 · US
Thin film capacitor (tfc) architectures for package substrates
US-2024213301-A1 · Jun 27, 2024 · US
Thin film capacitors (tfcs) in etched back deep via
US-2024213132-A1 · Jun 27, 2024 · US
Direct plating of copper on dielectrics for glass core plating
US-2024213131-A1 · Jun 27, 2024 · US
Method of forming a package substrate
US-2024188222-A1 · Jun 6, 2024 · US
Edge delamination and crack prevention methods for sinx and ti-cu enabled packages
US-2024006283-A1 · Jan 4, 2024 · US
Substrates having adhesion promotor layers and related methods
US-2024006300-A1 · Jan 4, 2024 · US
Silicide and silicon nitride layers between a dielectric and copper
US-2024006297-A1 · Jan 4, 2024 · US
Metallization surface treatment for integrated circuit packages
US-2024006380-A1 · Jan 4, 2024 · US
Organic adhesion promotor for dielectric adhesion to a copper trace
US-2023420322-A1 · Dec 28, 2023 · US
Plasma-induced surface functionalization of sinx thin film for improved adhesion of metal-dielectric for hsio
US-2023317584-A1 · Oct 5, 2023 · US
Surface functionalization of sinx thin film by wet etching for improved adhesion of metal-dielectric for hsio
US-2023317614-A1 · Oct 5, 2023 · US
Modification of sinx thin film for improved adhesion of metal-dielectrics for hsio packaging
US-2023317583-A1 · Oct 5, 2023 · US
Hybrid fine line spacing architecture for bump pitch scaling
US-11694898-B2 · Jul 4, 2023 · US
Through glass via with a metal wall
US-2023107096-A1 · Apr 6, 2023 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 46 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W70/685 | 28 |
| H10W70/05 | 24 |
| H10W90/724 | 19 |
| H10W70/635 | 17 |
| H10W70/65 | 13 |