Multilayered nanowire arrays with lateral interposers

Patent metadata

Field	Value
Publication number	US-11229090-B2
Application number	US-201916409107-A
Country	US
Kind code	B2
Filing date	May 10, 2019
Priority date	May 10, 2019
Publication date	Jan 18, 2022
Grant date	Jan 18, 2022

Abstract

A method for fabricating a multilayered metal nanowire array including providing a metal seed layer, stacking a plurality of porous templates on the seed layer so that a gap forms between each adjacent pair of templates, depositing by electroplating a metal in the pores so that the metal produces nanowires in the templates and lateral interposers in the gaps between the templates, and dissolving the templates so as to produce the multilayered nanowire array including the lateral interposers. The layers between the interposers can have the same or different thicknesses, the diameter and density of the pores in each layer can be the same or different and the metal deposited in the pores of the layers can be the same or different.

First claim

What is claimed is:

1. A method for fabricating a multilayered metal nanowire array, said method comprising:
stacking a plurality of porous templates so that a gap forms between each adjacent pair of templates;
depositing a metal in the pores of the templates so that the metal produces nanowires in the templates and lateral interposers in the gaps between the templates; and
dissolving the templates so as to produce the multilayered nanowire array including the lateral interposers.

2. The method according to claim 1 wherein stacking the templates includes stacking the templates to be in contact with each other so that the gaps are formed by the surface roughness of the templates.

3. The method according to claim 1 wherein stacking the templates includes placing spacers between the templates so that the gaps have a predetermined thickness.

4. The method according to claim 1 further comprising providing a metal seed layer on which the templates are stacked, wherein depositing a metal includes depositing the metal by an electroplating process that uses the seed layer.

5. The method according to claim 1 wherein depositing the metal includes depositing different metals in different templates.

6. The method according to claim 1 wherein stacking a plurality of porous templates includes stacking a plurality of templates that all have the same pore diameters, lengths and density.

7. The method according to claim 1 wherein stacking a plurality of porous templates includes stacking templates having different pore diameters, lengths and/or densities.

8. The method according to claim 1 wherein stacking a plurality of porous templates includes stacking a plurality of templates that all have the same thickness.

9. The method according to claim 8 wherein the thickness is 100 μm.

10. The method according to claim 1 wherein stacking a plurality of porous templates includes stacking templates having different thicknesses.

11. The method according to claim 1 wherein stacking the plurality of templates includes stacking the templates on a substrate.

12. The method according to claim 11 wherein the substrate is a heat source or a heat sink.

13. The method according to claim 1 wherein stacking a plurality of porous templates includes stacking ten porous templates.

14. A method for fabricating a multilayered metal nanowire array, said method comprising:
stacking a plurality of porous templates so that a gap forms between each adjacent pair of templates, wherein stacking the templates includes stacking the templates to be in contact with each other so that the gaps are formed by the surface roughness of the templates, and wherein stacking a plurality of porous templates includes stacking a plurality of templates that all have the same thickness;
depositing a metal in the pores of the templates so that the metal produces nanowires in the templates and lateral interposers in the gaps between the templates; and
dissolving the templates so as to produce the multilayered nanowire array including the lateral interposers.

Assignees

• Northrop Grumman Systems Corp

Inventors

• Barako Michael T
• Tice Jesse B
• Kuciej Max H

Classifications

• H10W40/255

  having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates · CPC title

• H10W40/258

  Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title

• H10W70/02

  of conductive package substrates serving as an interconnection, e.g. of metal plates (manufacture or treatment of leadframes H10W70/04) · CPC title

• H10W40/70 Primary

  Fillings or auxiliary members in containers or in encapsulations for thermal protection or control · CPC title

• H05B3/34 Primary

  flexible, e.g. heating nets or webs · CPC title