Compressible, thermally-conductive, removable nanocomposite gasket

Patent metadata

Field	Value
Publication number	US-9920178-B2
Application number	US-201514966746-A
Country	US
Kind code	B2
Filing date	Dec 11, 2015
Priority date	Dec 11, 2015
Publication date	Mar 20, 2018
Grant date	Mar 20, 2018

Abstract

A compressible, thermally-conductive, removable nanocomposite gasket includes: a nanocomposite foam; and a nanoparticle filler, wherein the nanocomposite foam has a filler loading of less than approximately 20%. A compressible, thermally-conductive, removable nanocomposite gasket includes: a nanocomposite foam; a nanoparticle filler; and a metallic mesh embedded in the foam wherein the nanocomposite foam has a filler loading of less than approximately 20%.

First claim

What is claimed is:

1. A compressible, thermally-conductive nanocomposite gasket, comprising:
an unbonded nanocomposite foam comprising partially oxidized graphene (GOx), wherein the carbon:oxygen (C:O) ratio of the GOx is adjusted using an elevated temperature treatment of the nanocomposite foam ranging between approximately 120 degrees Centigrade and approximately 180 degrees Centigrade, the elevated temperature treatment effects an in situ conversion of GOx to graphene;
a compressible nanoparticle filler; and
a corrugated metallic mesh embedded in the foam, wherein the mesh has thermal conductivity of at least approximately 1 Watt per meter-Kelvin [W/(m-K)], the mesh having a flexural modulus of less than approximately 0.5 GigaPascal (GPa),
wherein the graphene enhances the thermal conductivity of the nanocomposite foam by a factor of at least approximately ten, wherein the nanocomposite foam has a filler loading of less than approximately 20%, wherein the thermally-conductive gasket is configured to be positioned between a heat source and a heat sink, so as to direct heat from the heat source to the heat sink, and wherein the thermally-conductive gasket is removable from the position between the heat source and the heat sink with no requirement to remove adhesive and no risk of damaging surfaces, the thermally-conductive gasket not comprising an adhesive, wherein the thermally conductive gasket has a thermal conductivity of at least approximately 0.54 Watts per meter-Kelvin [W/(m-K)].

Assignees

• Northrop Grumman Systems Corp

Inventors

• Starkovich John A
• Tice Jesse B
• Silverman Edward M
• Peng Hsiao-Hu

Classifications

• C08J9/008 Primary

  Nanoparticles · CPC title

• C09K5/14

  Solid materials, e.g. powdery or granular · CPC title

• C08J2375/04

  Polyurethanes · CPC title

• C08J9/35 Primary

  Composite foams, i.e. continuous macromolecular foams containing discontinuous cellular particles or fragments · CPC title

• C08J2383/04

  Polysiloxanes · CPC title