Nanoparticle thermal interface agents for reducing thermal conductance resistance

Patent metadata

Field	Value
Publication number	US-9613882-B2
Application number	US-201615268980-A
Country	US
Kind code	B2
Filing date	Sep 19, 2016
Priority date	Jul 28, 2014
Publication date	Apr 4, 2017
Grant date	Apr 4, 2017

Abstract

A thermal interface material (TIM) using high thermal conductivity nano-particles, particularly ones with large aspect ratios, for enhancing thermal transport across boundary or interfacial layers that exist at bulk material interfaces is disclosed. At least one of the interfacial layers is a vertically aligned metal nanowire array. The nanoparticles do not need to be used in a fluid carrier or as filler material within a bonding adhesive to enhance thermal transport, but simply in a dry solid state. The nanoparticles may be equiaxed or acicular in shape with large aspect ratios like nanorods and nanowires.

First claim

What is claimed is:

1. A thermal interface material (TIM) comprising:
a vertically aligned metal nanowire array (VAMNW) for providing heat transfer between two surfaces in an electronic device; and
a plurality of high thermal conductivity nanorods or nanowires distributed on the surface of the VAMNW such that they are co-planar and lie flat in an interface region between the VAMNW and one of the surfaces in the electronic device.

2. The TIM of claim 1 wherein the nanorods or nanowires comprise nanorods or nanowires with aspect ratios between approximately 5 and over 1,000.

3. The TIM of claim 2 wherein the nanorods or nanowires further comprise silver nanowires having an aspect ratio of approximately 1000.

4. The TIM of claim 2 wherein the nanorods or nanowires further comprise copper nanowires or nanorods.

5. The TIM of claim 2 wherein the nanorods or nanowires further comprise gold nanowires or nanorods.

6. The TIM of claim 2 wherein the nanorods or nanowires further comprise nanotubes made of boron nitride.

7. The TIM of claim 1 wherein the nanorods or nanowires further comprise acicular nanorods or nanowires.

8. A thermal interface material (TIM) for use in an integrated circuit (IC) electronic device, comprising:
a vertically aligned metal nanowire array (VAMNW) for providing heat transfer between two surfaces in the electronic device; and
a plurality of high thermal conductivity nanoparticles distributed on the surface of the VAMNW such that they are co-planar and lie flat in an interface region between the VAMNW and one of the surfaces in the electronic device, said nanoparticles having aspect ratios between approximately 5 and over 1,000.

9. The TIM of claim 8 wherein the nanoparticles further comprise silver nanowires having an aspect ratio of approximately 1000.

10. The TIM of claim 8 wherein the nanoparticles further comprise copper nanowires or nanorods.

11. The TIM of claim 8 wherein the nanoparticles further comprise gold nanowires or nanorods.

12. The TIM of claim 8 wherein the nanoparticles further comprise nanodiamonds.

13. The TIM of claim 8 wherein the nanoparticles further comprise nanotubes made of boron nitride.

Assignees

• Northrop Grumman Systems Corp

Inventors

• Starkovich John A
• Tice Jesse B
• Silverman Edward M
• Peng Hsiao-Hu

Classifications

• H10W72/353

  not comprising solid metals or solid metalloids, e.g. ceramics · CPC title

• H10W72/352

  comprising metals or metalloids, e.g. solders · CPC title

• H10W72/351

  Materials of die-attach connectors · CPC title

• H10W72/325

  Die-attach connectors having a filler embedded in a matrix · CPC title

• H10W40/259

  Ceramics or glasses (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title