Laminate and packaging bag
US-2026077576-A1 · Mar 19, 2026 · US
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Tanaka Ryota patents
Tanaka Ryota is listed as an inventor on 45 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Tanaka Ryota |
| Total patents | 45 |
| First publication | Jan 17, 2017 |
| Latest publication | Mar 19, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Multilayer body and packaging material
US-12565028-B2 · Mar 3, 2026 · US
Laminate and packaging bag
US-12502877-B2 · Dec 23, 2025 · US
Laminated body, packaging material, and packaging body
US-2025367915-A1 · Dec 4, 2025 · US
Semiconductor device, power module and manufacturing method for the semiconductor device
US-12328884-B2 · Jun 10, 2025 · US
Visible light responsive photocatalyst
US-2025144602-A1 · May 8, 2025 · US
Photocatalyst composition, iodine solution, photocatalyst dispersion liquid, antibacterial activation method, and antibacterial activation apparatus
US-2024335820-A1 · Oct 10, 2024 · US
Biomarker for predicting prognosis of cancer patient, method for predicting prognosis of cancer patient, method for predicting effect of cancer therapeutic drug in cancer patient, and kit for predicting prognosis of cancer patient
US-2024318262-A1 · Sep 26, 2024 · US
Semiconductor device and method for manufacturing same
US-12068411-B2 · Aug 20, 2024 · US
Laminate, package, and packaged article
US-2024262090-A1 · Aug 8, 2024 · US
Recent patents
Latest publications not already listed above.
Laminate, package, and packaged article
US-2024198644-A1 · Jun 20, 2024 · US
Optical apparatus, on-board system, movable apparatus, control method of optical apparatus, and storage medium
US-2024175747-A1 · May 30, 2024 · US
Semiconductor device and method of manufacturing semiconductor device
US-11996442-B2 · May 28, 2024 · US
Gas barrier film, laminate, and packaging material
US-2024149572-A1 · May 9, 2024 · US
Semiconductor device and method for manufacturing same
US-11881526-B2 · Jan 23, 2024 · US
Semiconductor device and method for manufacturing same
US-2023411516-A1 · Dec 21, 2023 · US
Multilayer body and packaging material
US-2023330976-A1 · Oct 19, 2023 · US
Semiconductor device and method of manufacturing semiconductor device
US-11756994-B2 · Sep 12, 2023 · US
Semiconductor device, power module and manufacturing method for the semiconductor device
US-2023253512-A1 · Aug 10, 2023 · US
Packaging material, packaging bag, and packaging body
US-2023227228-A1 · Jul 20, 2023 · US
Semiconductor device, power module and method for manufacturing the semiconductor device
US-11664466-B2 · May 30, 2023 · US
Gas barrier laminate and packaging bag
US-2023087185-A1 · Mar 23, 2023 · US
Learning apparatus, text generation apparatus, learning method, text generation method and program
US-2023076576-A1 · Mar 9, 2023 · US
Semiconductor device and method of manufacturing semiconductor device
US-2023074093-A1 · Mar 9, 2023 · US
Semiconductor device and method of manufacturing semiconductor device
US-2023013819-A1 · Jan 19, 2023 · US
Semiconductor device and manufacturing method thereof
US-11557647-B2 · Jan 17, 2023 · US
Semiconductor device and method for manufacturing the same
US-11557674-B2 · Jan 17, 2023 · US
Semiconductor device and method of manufacturing semiconductor device
US-11476326-B2 · Oct 18, 2022 · US
Laminate and packaging bag
US-2022153006-A1 · May 19, 2022 · US
Semiconductor device and method of manufacturing semiconductor device
US-2022085157-A1 · Mar 17, 2022 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Nissan Motor | 25 |
| Renault Sas | 17 |
| Toppan Inc | 7 |
| Fujitsu Ltd | 4 |
| Toppan Holdings Inc | 4 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10D62/8325 | 19 |
| H10D30/603 | 14 |
| H10D30/0221 | 14 |
| H10D62/111 | 14 |
| H01L29/1608 | 13 |