Cantilevered leadframe support structure for magnetic wireless transfer between integrated circuit dies
US-11676884-B2 · Jun 13, 2023 · US
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Sutton Benjamin Michael patents
Sutton Benjamin Michael is listed as an inventor on 17 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Sutton Benjamin Michael |
| Total patents | 17 |
| First publication | Jan 22, 2015 |
| Latest publication | Jun 13, 2023 |
Notable patents
Publications ranked by popularity score, then publication date.
Cantilevered Leadframe Support Structure for Magnetic Wireless Transfer between Integrated Circuit Dies
US-2021249336-A1 · Aug 12, 2021 · US
Cantilevered leadframe support structure for magnetic wireless transfer between integrated circuit dies
US-10991641-B2 · Apr 27, 2021 · US
Embedded coil assembly and method of making
US-10978239-B2 · Apr 13, 2021 · US
Embedded coil assembly and method of making
US-10854370-B2 · Dec 1, 2020 · US
Cantilevered Leadframe Support Structure for Magnetic Wireless Transfer between Integrated Circuit Dies
US-2020266131-A1 · Aug 20, 2020 · US
Cantilevered leadframe support structure for magnetic wireless transfer between integrated circuit dies
US-10643929-B2 · May 5, 2020 · US
Embedded coil assembly and production method
US-10256027-B2 · Apr 9, 2019 · US
Embedded coil assembly and method of making
US-2018336994-A1 · Nov 22, 2018 · US
Embedded coil assembly and method of making
US-9824811-B2 · Nov 21, 2017 · US
Recent patents
Latest publications not already listed above.
Embedded coil assembly and method of making
US-2017294263-A1 · Oct 12, 2017 · US
Integrated circuit package and method
US-9527728-B2 · Dec 27, 2016 · US
Embedded coil assembly and production method
US-2016181004-A1 · Jun 23, 2016 · US
Embedded coil assembly and method of making
US-2016181003-A1 · Jun 23, 2016 · US
Integrated circuit package method
US-2016096727-A1 · Apr 7, 2016 · US
Cantilevered Leadframe Support Structure for Magnetic Wireless Transfer Between Integrated Circuit Dies
US-2015325501-A1 · Nov 12, 2015 · US
Integrated circuit package and method
US-2015021721-A1 · Jan 22, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Texas Instruments Inc | 17 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H01F27/2804 | 8 |
| H01F17/0033 | 8 |
| H01F27/022 | 8 |
| H01F17/062 | 8 |
| H01F41/041 | 8 |