Embedded coil assembly and method of making

Patent metadata

Field	Value
Publication number	US-10978239-B2
Application number	US-201715634336-A
Country	US
Kind code	B2
Filing date	Jun 27, 2017
Priority date	Dec 19, 2014
Publication date	Apr 13, 2021
Grant date	Apr 13, 2021

Abstract

An embedded coil assembly embodiment includes a ferrite ring having an annular axis. The ferrite ring is positioned on a conductive metal surface. A plurality of separate, spaced apart conductive structures extend over the ferrite ring and are attached to the conductive metal surface in a first region of the conductive surface positioned radially outwardly of the annular axis of the ferrite ring and in a second region of the conductive surface positioned radially inwardly of the annular axis of the ferrite ring. An encapsulation layer covers, the ferrite ring and at least a portion of the plurality of conductive structures.

First claim

What is claimed is:

1. An embedded coil assembly comprising:
a ferrite ring including an annular axis, said ferrite ring positioned on a conductive metal surface;
a plurality of conductive structures attached to the conductive metal surface in a first region of the conductive metal surface positioned radially outwardly of the annular axis of the ferrite ring and in a second region of the conductive metal surface positioned radially inwardly of the annular axis of the ferrite ring;
a first plurality of metal pillars and a second plurality of metal pillars both including exposed vertically extending surfaces, the second plurality of metal pillars connected to at least one of the plurality of conductive structures; and
an encapsulation layer covering the ferrite ring, at least a portion of the plurality of conductive structures, and portions of the first and second plurality of metal pillars, wherein the exposed vertically extending surfaces are on side surfaces of the embedded coil assembly.

2. The embedded coil assembly of claim 1 , wherein the plurality of conductive structures is separate and spaced apart.

3. The embedded coil assembly of claim 1 , wherein the plurality of conductive structures comprises metal pillars.

4. The embedded coil assembly of claim 1 , wherein the plurality of conductive structures comprises a patterned metal layer.

5. The embedded coil assembly of claim 1 , wherein the plurality of conductive structures comprises filled vias.

6. The embedded coil assembly of claim 1 , wherein the plurality of conductive structures comprises at least two of metal pillars, bond wires, a patterned metal layer and filled vias.

7. The embedded coil assembly of claim 1 , wherein the plurality of conductive structures comprises at least two of metal pillars and a patterned metal layer connecting the at least two of metal pillars.

8. The embedded coil assembly of claim 7 , wherein a portion of the patterned metal layer is exposed from the embedded coil assembly.

9. The embedded coil assembly of claim 1 , wherein the plurality of conductive structures comprises at least two of metal pillars and a bond wire connecting the at least two of metal pillars.

10. An embedded coil assembly comprising:
a ferrite ring including an annular axis, said ferrite ring positioned on a conductive metal surface;
a first plurality of conductive structures and a second plurality of conductive structures, the first plurality of conductive structures attached to the conductive metal surface in a first region of the conductive metal surface positioned radially outwardly of the annular axis of the ferrite ring, the second plurality of conductive structures in a second region of the conductive metal surface positioned radially inwardly of the annular axis of the ferrite ring;
a plurality of patterned metal layers connecting the first plurality of conductive structures and a second plurality of conductive structures;
a first plurality of metal pillars and a second plurality of metal pillars both including vertically extending surfaces exposed from side surfaces of the embedded coil assembly, the second plurality of metal pillars connected to at least one of the plurality of conductive structures; and
an encapsulation layer covering the ferrite ring, at least a portion of the first and second plurality of conductive structures, and portions of the first and second plurality of metal pillars.

11. The embedded coil assembly of claim 10 , wherein portions of the conductive metal surface are exposed from the embedded coil assembly.

12. The embedded coil assembly of claim 10 , wherein at least a portion of vertical extending surfaces of the first plurality of conductive structures and the second plurality of conductive structures are exposed from the embedded coil assembly.

13. The embedded coil assembly of claim 10 , wherein the plurality of patterned metal layers includes a copper clad lamination layer.

14. The embedded coil assembly of claim 10 , wherein the plurality of patterned metal layers includes a pie shape on a surface of the embedded coil assembly.

15. The embedded coil assembly of claim 10 , wherein the first and second plurality of conductive structures comprises filled vias.

16. The embedded coil assembly of claim 10 further comprising a recess in between the second plurality of conductive structures.

17. The embedded coil assembly of claim 7 , wherein a portion of the at least two of metal pillars are exposed above a top surface of the encapsulation layer.

18. The embedded coil assembly of claim 12 , wherein the portion of the vertical extending surfaces of the first plurality of conductive structures and the second plurality of conductive structures are exposed from the embedded coil assembly, are exposed above a top surface of the encapsulation layer.

Assignees

• Texas Instruments Inc

Inventors

• Li Haiying
• Sutton Benjamin Michael
• Li Ming

Classifications

• H01F27/2895

  Windings disposed upon ring cores · CPC title

• H01F2027/2809

  on stacked layers · CPC title

• H01F17/045

  with core of cylindric geometry and coil wound along its longitudinal axis, i.e. rod or drum core · CPC title

• H01F27/2804 Primary

  Printed windings · CPC title

• H01F41/041

  Printed circuit coils (apparatus or processes for manufacturing printed circuits in general H05K3/00) · CPC title