Embedded coil assembly and method of making

Patent metadata

Field	Value
Publication number	US-9824811-B2
Application number	US-201414576904-A
Country	US
Kind code	B2
Filing date	Dec 19, 2014
Priority date	Dec 19, 2014
Publication date	Nov 21, 2017
Grant date	Nov 21, 2017

Abstract

An embedded coil assembly embodiment includes a ferrite ring having an annular axis. The ferrite ring is positioned on a conductive metal surface. A plurality of separate, spaced apart conductive structures extend over the ferrite ring and are attached to the conductive metal surface in a first region of the conductive surface positioned radially outwardly of the annular axis of the ferrite ring and in a second region of the conductive surface positioned radially inwardly of the annular axis of the ferrite ring. An encapsulation layer covers, the ferrite ring and at least a portion of the plurality of conductive structures.

First claim

What is claimed is:

1. An embedded coil assembly comprising:
an annular metal layer having an upper surface;
a first plurality of metal pillars arranged in an inner ring on the upper surface of the annular metal layer;
a second plurality of metal pillars arranged in an intermediate ring on the upper surface of the annular metal layer;
a third plurality of metal pillars arranged in an outer ring on the upper surface of the annular metal layer;
a ferrite ring on the upper surface of the annular metal layer between the first plurality of metal pillars and the second plurality of metal pillars;
a plurality of conductive structures that each connect corresponding ones of the first plurality of metal pillars and the second plurality of metal pillars; and
an encapsulation layer covering, the ferrite ring, the first and second plurality of metal pillars, at least a portion of the third plurality of metal pillars and at least a portion of the plurality of conductive structures.

2. The embedded coil assembly of claim 1 wherein said metal layer comprises a plurality of spaced apart circumferential segments, wherein each segment has at least one of said first plurality of metal pillars, at least one of said second plurality of metal pillars and at least one of said third plurality of metal pillars.

3. The embedded coil assembly of claim 1 wherein said plurality of conductive structures comprises a plurality of bond wires.

4. The embedded coil assembly of claim 1 wherein said plurality of conductive structures comprises circuitry patterned on top of said encapsulation layer.

5. The embedded coil assembly of claim 4 wherein said plurality of conductive structures further comprises a plurality of filled vias connecting said patterned circuitry and said plurality of metal pillars.

6. The embedded coil assembly of claim 1 wherein at least one of said third plurality of metal pillars has an exposed vertically extending surface.

7. The embedded coil assembly of claim 1 wherein said metal pillars comprise at least one of sintered metal pillars and placed metal pillars.

8. The embedded coil assembly of claim 1 wherein said metal pillars are formed from stencil printed metal powder.

9. The embedded coil assembly of claim 1 , said metal layer having a hole therethrough at a location within said inner ring of metal pillars.

10. An embedded coil assembly comprising:
an annular metal layer having a first surface;
a first plurality of metal pillars arranged in an inner ring on the first surface of the annular metal layer;
a second plurality of metal pillars arranged in an intermediate ring on a first surface of an annular metal layer;
a third plurality of metal pillars arranged in an outer ring on the first surface of the annular metal layer;
a ferrite ring on the first surface of the annular metal layer between the first plurality of metal pillars and the second plurality of metal pillars; and
an encapsulation layer covering, the ferrite ring, the first and second plurality of metal pillars, and at least a portion of the third plurality of metal pillars.

11. The embedded coil assembly of claim 10 , wherein each of the plurality of conductive structures connects corresponding ones of the first plurality of metal pillars and the second plurality of metal pillars.

12. The embedded coil assembly of claim 10 , wherein the annular metal layer comprises a plurality of spaced apart circumferential segments, wherein each segment has at least one of said first plurality of metal pillars, at least one of said second plurality of metal pillars and at least one of said third plurality of metal pillars.

13. The embedded coil assembly of claim 10 , wherein the plurality of conductive structures comprises a plurality of bond wires.

14. The embedded coil assembly of claim 10 , wherein each of the plurality of bond wires includes a ball bond at two ends.

15. The embedded coil assembly of claim 10 , wherein a portion of each of the third plurality of metal pillars is exposed from the encapsulation layer.

16. An embedded coil assembly comprising:
an annular metal layer having a first surface;
a first plurality of metal pillars arranged in an inner ring on the first surface of the annular metal layer;
a second plurality of metal pillars arranged in an intermediate ring on the first surface of an annular metal layer;
a third plurality of metal pillars arranged in an outer ring on the first surface of the annular metal layer;
a ferrite ring on the first surface of the annular metal layer between the first plurality of metal pillars and the second plurality of metal pillars; and
an encapsulation layer covering, the ferrite ring, the first and second plurality of metal pillars, and at least a portion of the third plurality of metal pillars, wherein portions of the annular metal layer is exposed from the encapsulation layer.

17. The embedded coil assembly of claim 16 , wherein each of the plurality of conductive structures connects corresponding ones of the first plurality of metal pillars and the second plurality of metal pillars.

18. The embedded coil assembly of claim 16 , wherein the annular metal layer comprises a plurality of spaced apart circumferential segments, wherein each segment has at least one of said first plurality of metal pillars, at least one of said second plurality of metal pillars and at least one of said third plurality of metal pillars.

19. The embedded coil assembly of claim 16 , wherein a portion of each of the third plurality of metal pillars is exposed from the encapsulation layer.

Assignees

• Texas Instruments Inc

Inventors

• Li Haiying
• Sutton Benjamin Michael
• Li Ming

Classifications

• H01F17/045

  with core of cylindric geometry and coil wound along its longitudinal axis, i.e. rod or drum core · CPC title

• H01F27/327

  Encapsulating or impregnating (encapsulating coil and core H01F27/022) · CPC title

• H01F27/022

  Encapsulation · CPC title

• H01F17/0033

  with the coil helically wound around a magnetic core · CPC title

• H01F17/062

  Toroidal core with turns of coil around it · CPC title