Semiconductor dies having ultra-thin wafer backmetal systems, microelectronic devices containing the same, and associated fabrication methods
US-11616040-B2 · Mar 28, 2023 · US
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Sun Tianwei patents
Sun Tianwei is listed as an inventor on 9 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Sun Tianwei |
| Total patents | 9 |
| First publication | Mar 16, 2017 |
| Latest publication | Mar 28, 2023 |
Notable patents
Publications ranked by popularity score, then publication date.
Power amplifier packages containing peripherally-encapsulated dies and methods for the fabrication thereof
US-11128268-B1 · Sep 21, 2021 · US
Semiconductor dies having ultra-thin wafer backmetal systems, microelectronic devices containing the same, and associated fabrication methods
US-2021167033-A1 · Jun 3, 2021 · US
Semiconductor dies having ultra-thin wafer backmetal systems, microelectronic devices containing the same, and associated fabrication methods
US-10923451-B2 · Feb 16, 2021 · US
Semiconductor dies having ultra-thin wafer backmetal systems, microelectronic devices containing the same, and associated fabrication methods
US-2021020595-A1 · Jan 21, 2021 · US
Segmented field plate structure
US-9893156-B2 · Feb 13, 2018 · US
Segmented field plate structure
US-2017200794-A1 · Jul 13, 2017 · US
Segmented field plate structure
US-9647075-B2 · May 9, 2017 · US
Segmented field plate structure
US-2017077245-A1 · Mar 16, 2017 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Nxp Usa Inc | 8 |
| Freescale Semiconductor Inc | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W20/40 | 8 |
| H10W76/134 | 5 |
| H10W72/551 | 4 |
| H10W72/0198 | 4 |
| H10W72/884 | 4 |