Segmented field plate structure

Patent metadata

Field	Value
Publication number	US-9647075-B2
Application number	US-201514856154-A
Country	US
Kind code	B2
Filing date	Sep 16, 2015
Priority date	Sep 16, 2015
Publication date	May 9, 2017
Grant date	May 9, 2017

Abstract

A device includes a transistor formed over a substrate. The transistor includes a source structure, a drain structure, and a gate structure. A dielectric layer is formed over the transistor, and a plurality of vias are electrically connected to the source structure. A metal layer is formed over the dielectric layer. The metal layer includes a field plate over the gate structure, a plurality of contact pads over each via, and a plurality of fingers interconnecting each one of the plurality of contact pads to the field plate.

First claim

What is claimed is:

1. A device, comprising:
a transistor formed over a substrate, the transistor includes a source structure, a drain structure, and a gate structure;
a dielectric layer over the transistor;
a plurality of vias electrically connected to the source structure; and
a metal layer over the dielectric layer, the metal layer including:
a field plate over the gate structure, the field plate including a notch over the gate structure,
a plurality of contact pads over each via, and
a plurality of fingers interconnecting each one of the plurality of contact pads to the field plate.

2. The device of claim 1 , wherein each one of the plurality of fingers is directly connected to one and only one of contact pads.

3. The device of claim 1 , wherein each one of the plurality of fingers has a width of about 5 um to 10 um.

4. The device of claim 1 , wherein the plurality of fingers are separated from one another by at least about 5 um.

5. The device of claim 1 , wherein the notch has a width of about 5 um to 10 um.

6. The device of claim 1 , wherein the metal layer forms a metal contact over the substrate, the metal contact being electrically connected to the drain structure.

7. The device of claim 1 , wherein the transistor is a gallium nitride field effect transistor.

8. A device, comprising:
a transistor formed over a substrate;
a dielectric layer over the transistor; and
a metal layer over the dielectric layer, the metal layer including:
a plurality of contact pads electrically connected to a first structure of the transistor,
a metal contact electrically connected to a second structure of the transistor, and
a field plate, the field plate being electrically connected to the plurality of contact pads and not electrically connected to the metal contact, the field plate including a notch over a gate structure of the transistor.

9. The device of claim 8 , wherein the plurality of contact pads, metal contact, and field plate are formed by patterning the metal layer.

10. The device of claim 8 , wherein the metal layer includes a plurality of fingers connecting the field plate to each of the plurality of contact pads.

11. The device of claim 10 , wherein each one of the plurality of fingers has a width of about 5 um to 10 um.

12. The device of claim 10 , wherein each one of the plurality of fingers are separated by at least about 5 um.

13. The device of claim 8 , wherein the field plate defines an opening over a third structure of the transistor.

14. The device of claim 13 , wherein the opening has a width of about 5 um to 10 um.

15. The device of claim 8 , wherein the notch has a width of about 5 um to 10 um.

16. The device of claim 8 , wherein the transistor is a gallium nitride field effect transistor.

17. The device of claim 8 , wherein the first structure is characterized as a source structure of the transistor, and the second structure is characterized as a drain structure of the transistor.

Assignees

• Freescale Semiconductor Inc
• Nxp Usa Inc

Inventors

• Huang Jenn Hwa
• Sun Tianwei
• Teplik James A

Classifications

• H10P50/264

  by chemical means · CPC title

• H10P14/40

  of conductive or resistive materials · CPC title

• H10W20/40

  Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes · CPC title

• H10W20/056

  by filling conductive material into holes, grooves or trenches · CPC title

• H01L21/3205

  Electricity · mapped topic