Copper paste for joining, method for manufacturing joined body, and joined body
US-12564879-B2 · Mar 3, 2026 · US
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Sugama Chie patents
Sugama Chie is listed as an inventor on 26 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Sugama Chie |
| Total patents | 26 |
| First publication | Sep 6, 2018 |
| Latest publication | Mar 3, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Method for producing bonded object and semiconductor device and copper bonding paste
US-11890681-B2 · Feb 6, 2024 · US
Member connection method
US-11887960-B2 · Jan 30, 2024 · US
Method for manufacturing thermoelectric conversion module, thermoelectric conversion module, and binder for thermoelectric conversion module
US-11575076-B2 · Feb 7, 2023 · US
Copper paste for pressureless bonding, bonded body and semiconductor device
US-11532588-B2 · Dec 20, 2022 · US
Copper paste for joining, method for manufacturing joined body, and joined body
US-2022371087-A1 · Nov 24, 2022 · US
Method for producing joined body, and joining material
US-11483936-B2 · Oct 25, 2022 · US
Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device
US-11462502-B2 · Oct 4, 2022 · US
Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device
US-11370066-B2 · Jun 28, 2022 · US
Method for producing bonded object and semiconductor device and copper bonding paste
US-2022028824-A1 · Jan 27, 2022 · US
Recent patents
Latest publications not already listed above.
Member connection method
US-2021351157-A1 · Nov 11, 2021 · US
Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device
US-11040416-B2 · Jun 22, 2021 · US
Copper paste for pressureless bonding, bonded body and semiconductor device
US-2021143121-A1 · May 13, 2021 · US
Copper paste for pressureless bonding, bonded body and semiconductor device
US-10930612-B2 · Feb 23, 2021 · US
Method for producing joined body, and joining material
US-2020344893-A1 · Oct 29, 2020 · US
Method for manufacturing thermoelectric conversion module, thermoelectric conversion module, and binder for thermoelectric conversion module
US-2020295248-A1 · Sep 17, 2020 · US
Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device
US-10748865-B2 · Aug 18, 2020 · US
Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device
US-2020176411-A1 · Jun 4, 2020 · US
Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device
US-2020130109-A1 · Apr 30, 2020 · US
Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device
US-2020108471-A1 · Apr 9, 2020 · US
Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device
US-2020075528-A1 · Mar 5, 2020 · US
Assembly and semiconductor device
US-10566304-B2 · Feb 18, 2020 · US
Copper paste for pressureless bonding, bonded body and semiconductor device
US-2019355690-A1 · Nov 21, 2019 · US
Copper paste for joining, method for producing joined body, and method for producing semiconductor device
US-10363608-B2 · Jul 30, 2019 · US
Assembly and semiconductor device
US-2018342478-A1 · Nov 29, 2018 · US
Copper paste for joining, method for producing joined body, and method for producing semiconductor device
US-2018250751-A1 · Sep 6, 2018 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Hitachi Chemical Co Ltd | 20 |
| Showa Denko Materials Co Ltd | 12 |
| Resonac Corp | 3 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| B22F7/064 | 20 |
| B22F1/052 | 20 |
| H10W72/884 | 20 |
| H10W72/07331 | 18 |
| H10W72/352 | 18 |