Copper paste for joining, method for manufacturing joined body, and joined body

Patent metadata

Field	Value
Publication number	US-12564879-B2
Application number	US-201917764273-A
Country	US
Kind code	B2
Filing date	Sep 30, 2019
Priority date	Sep 30, 2019
Publication date	Mar 3, 2026
Grant date	Mar 3, 2026

Abstract

A copper paste for joining contains metal particles and a dispersion medium, in which the copper paste for joining contains copper particles as the metal particles, and the copper paste for joining contains dihydroterpineol as the dispersion medium. A method for manufacturing a joined body is a method for manufacturing a joined body which includes a first member, a second member, and a joining portion that joins the first member and the second member, the method including: a first step of printing the above-described copper paste for joining to at least one joining surface of the first member and the second member to prepare a laminate having a laminate structure in which the first member, the copper paste for joining, and the second member are laminated in this order; and a second step of sintering the copper paste for joining of the laminate.

First claim

The invention claimed is:

1 . A copper paste for joining, comprising:
metal particles comprising copper particles; and a dispersion medium comprising dihydroterpineol, wherein a content of the dispersion medium is 5 to less than 15% by mass on the basis of the total mass of the copper paste for joining, a content of the dihydroterpineol is 50 to 100% by mass on the basis of the total mass of the dispersion medium, a content of the metal particles is greater than 85% on the basis of the total amount of the copper paste for joining, and a viscosity of the copper paste for joining at 25° C. is 100 to 250 Pa·s.

2 . The copper paste for joining according to claim 1 , wherein a content of the metal particles is 87 to 95% by mass on the basis of the total amount of the copper paste for joining.

3 . The copper paste for joining according to claim 1 , wherein the dispersion medium further contains a compound having a boiling point of 300° C. or higher.

4 . The copper paste for joining according to claim 1 , wherein a viscosity at 25° C. is 100 to 200 Pa·s.

5 . The copper paste for joining according to claim 1 , wherein a content of the copper particles is 80 to 100% by mass on the basis of the total mass of the metal particles.

6 . The copper paste for joining according to claim 1 , wherein the copper paste for joining is for screen printing.

7 . The copper paste for joining according to claim 1 , wherein the copper paste for joining contains submicro copper particles having a volume average particle diameter of 0.12 to 0.8 μm and flake-shaped micro copper particles having a maximum diameter of 2 to 50 μm and an aspect ratio of 3.0 or more as the copper particles.

8 . The copper paste for joining according to claim 7 , wherein a content of the submicro copper particles is 30 to 90% by mass on the basis of the total mass of the copper particles, and
a content of the micro copper particles is 10 to 70% by mass on the basis of the total mass of the copper particles.

9 . The copper paste for joining according to claim 1 , wherein the copper paste for joining is for non-pressurization joining.

10 . A method for manufacturing a joined body which includes a first member, a second member, and a joining portion that joins the first member and the second member, the method comprising:
a first step of printing the copper paste for joining according to claim 1 to at least one joining surface of the first member and the second member to prepare a laminate having a laminate structure in which the first member, the copper paste for joining, and the second member are laminated in this order; and a second step of sintering the copper paste for joining of the laminate.

11 . The method for manufacturing a joined body according to claim 10 , wherein the printing is screen printing.

12 . The method for manufacturing a joined body according to claim 10 , wherein in the second step, the copper paste for joining is sintered by being heated under non-pressurization.

13 . The method for manufacturing a joined body according to claim 10 , wherein at least one of the first member and the second member is a semiconductor element.

14 . A joined body comprising: a first member; a second member; and a joining portion that joins the first member and the second member, wherein the joining portion is made of a sintered body of the copper paste for joining according to claim 1 .

15 . The joined body according to claim 14 , wherein at least one of the first member and the second member is a semiconductor element.

16 . The copper paste for joining according to claim 1 , wherein the content of the dispersion medium is 11 to 13 parts by mass when a total mass of the metal particles contained in the copper paste for joining is regarded as 100 parts by mass.

17 . The copper paste for joining according to claim 1 , wherein the content of the dispersion medium is 10 to 15 parts by mass when a total mass of the metal particles contained in the copper paste for joining is regarded as 100 parts by mass.

18 . The copper paste for joining according to claim 1 , wherein the content of the dihydroterpineol is 50 to 90% by mass on the basis of the total mass of the dispersion medium.

19 . The copper paste for joining according to claim 1 , wherein the content of the dihydroterpineol is 60 to 80% by mass on the basis of the total mass of the dispersion medium.

Assignees

• Showa Denko Materials Co Ltd
• Resonac Corp

Inventors

• Negishi Motohiro
• Nakako Hideo
• Natori Michiko
• Ishikawa Dai
• Sugama Chie
• Kawana Yuki

Classifications

• H10W72/30

  Die-attach connectors · CPC title

• H10W72/50

  Bond wires · CPC title

• H10W72/60

  Strap connectors, e.g. thick copper clips for grounding of power devices · CPC title

• H10W72/851

  Dispositions of multiple connectors or interconnections · CPC title

• H10W72/073

  of die-attach connectors · CPC title