Method for producing composite material
US-2024052186-A1 · Feb 15, 2024 · US
using an intermediate powder layer
using an intermediate powder layer · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B22F7/064 |
| Official title | {using an intermediate powder layer} |
| Display label | using an intermediate powder layer |
| Total patents | 434 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 12 |
| 2016 | 21 |
| 2017 | 25 |
| 2018 | 30 |
| 2019 | 40 |
| 2020 | 55 |
| 2021 | 50 |
| 2022 | 46 |
| 2023 | 47 |
| 2024 | 65 |
| 2025 | 34 |
| 2026 | 9 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Particles, connecting material and connection structure
US-2018301237-A1 · Oct 18, 2018 · US
Hybrid diffusion-brazing process and hybrid diffusion-brazed article
US-9849533-B2 · Dec 26, 2017 · US
Metal sintering preparation and the use thereof for the connecting of components
US-2017326640-A1 · Nov 16, 2017 · US
Production method for r-t-b-based sintered magnet
US-2017330659-A1 · Nov 16, 2017 · US
Degradable carbide grip
US-2017314103-A1 · Nov 2, 2017 · US
Braze materials and earth-boring tools comprising braze materials
US-2017304959-A1 · Oct 26, 2017 · US
Article, component, and method of making a component
US-2017306775-A1 · Oct 26, 2017 · US
Composite nanometal paste containing copper filler and joining method
US-9796052-B2 · Oct 24, 2017 · US
Sinterable bonding material and semiconductor device using the same
US-2017294404-A1 · Oct 12, 2017 · US
Composite bodies and their manufacture
US-2017282466-A1 · Oct 5, 2017 · US
Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board
US-2017290150-A1 · Oct 5, 2017 · US
Methods of forming a cutting element including a multi-layered cutting table, and related cutting elements and earth-boring tools
US-2017268297-A1 · Sep 21, 2017 · US
Surface heater, electric range having the same, and manufacturing method thereof
US-2017245323-A1 · Aug 24, 2017 · US
Methods and compositions for brazing
US-9731384-B2 · Aug 15, 2017 · US
Polycrystalline diamond composite compact elements and tools incorporating same
US-9719308-B2 · Aug 1, 2017 · US
Method for manufacturing a wear resistant component having mechanically interlocked cemented carbide bodies
US-2017203368-A1 · Jul 20, 2017 · US
Method for attaching a porous metal layer to a metal substrate
US-9656358-B2 · May 23, 2017 · US
Semiconductor package and method for manufacturing same
US-2017092560-A1 · Mar 30, 2017 · US
Methods For Evaluating The Properties Of Transient Liquid Phase Bonds
US-2017080493-A1 · Mar 23, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B22F7/064?
- CPC B22F7/064 is the Cooperative Patent Classification code for “using an intermediate powder layer.”
- How many patents are filed under CPC B22F7/064 (using an intermediate powder layer)?
- Our database includes 434 publications tagged with this CPC code.
- Is patent activity under CPC B22F7/064 growing?
- Publication counts under this code: 65 in 2024 vs 34 in 2025 (latest complete years).