Multilayer ceramic electronic device, circuit substrate and manufacturing method of multilayer ceramic electronic device
US-12340949-B2 · Jun 24, 2025 · US
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Shimura Tetsuo patents
Shimura Tetsuo is listed as an inventor on 28 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Shimura Tetsuo |
| Total patents | 28 |
| First publication | Feb 5, 2015 |
| Latest publication | Jun 24, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Multilayer ceramic electronic device, circuit substrate and manufacturing method of multilayer ceramic electronic device
US-2023352245-A1 · Nov 2, 2023 · US
Multilayer ceramic capacitor and manufacturing method therefor
US-11488783-B2 · Nov 1, 2022 · US
Ceramic electronic device and manufacturing method of the same
US-11282641-B2 · Mar 22, 2022 · US
Multi-layer ceramic capacitor and method of manufacturing the same
US-RE48877-E · Jan 4, 2022 · US
Ceramic electronic device and manufacturing method of the same
US-2021118615-A1 · Apr 22, 2021 · US
Ceramic capacitor, circuit substrate and manufacturing method of ceramic capacitor
US-10903012-B2 · Jan 26, 2021 · US
Multilayer ceramic capacitor and manufacturing method therefor
US-2020411249-A1 · Dec 31, 2020 · US
Electronic component with interposer
US-10854390-B2 · Dec 1, 2020 · US
Electronic component with metal terminals
US-10460874-B2 · Oct 29, 2019 · US
Recent patents
Latest publications not already listed above.
Electronic component with interposer
US-2019287723-A1 · Sep 19, 2019 · US
Ceramic capacitor, circuit substrate and manufacturing method of ceramic capacitor
US-2019228911-A1 · Jul 25, 2019 · US
Electronic component fuse and fused electronic component module
US-10224707-B2 · Mar 5, 2019 · US
Multilayer ceramic capacitor having dielectric layers containing ceramic grains constituted by primarily BaTiO3 and additionally Mo, Mn, R, and V/W
US-10096425-B2 · Oct 9, 2018 · US
Electronic component with metal terminals
US-2018240595-A1 · Aug 23, 2018 · US
Electric circuit device
US-9966193-B2 · May 8, 2018 · US
Electronic component fuse and fused electronic component module
US-2017317484-A1 · Nov 2, 2017 · US
Electronic component with interposer
US-2017290161-A1 · Oct 5, 2017 · US
Multilayer ceramic capacitor
US-9721727-B2 · Aug 1, 2017 · US
Electric circuit device
US-2017186551-A1 · Jun 29, 2017 · US
Multi-layer ceramic capacitor and method of manufacturing the same
US-9679698-B2 · Jun 13, 2017 · US
Multilayer ceramic capacitor
US-2017032894-A1 · Feb 2, 2017 · US
Multilayer ceramic capacitor
US-2017032895-A1 · Feb 2, 2017 · US
Multilayer ceramic capacitor
US-2016189865-A1 · Jun 30, 2016 · US
Multi-layer ceramic capacitor
US-9287046-B2 · Mar 15, 2016 · US
Dielectric ceramic, multi-layer ceramic capacitor and method of manufacturing the same
US-9281125-B2 · Mar 8, 2016 · US
Multi-layer ceramic capacitor and method of manufacturing the same
US-2015070817-A1 · Mar 12, 2015 · US
Multi-layer ceramic capacitor
US-2015036264-A1 · Feb 5, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Taiyo Yuden Kk | 30 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H01G4/30 | 28 |
| H01G4/1227 | 17 |
| H01G4/12 | 12 |
| C04B35/4682 | 10 |
| C04B2235/3239 | 10 |